有谁知道Werner Engelmaier或有他讲课及专业内容 可靠性技术 新手提问 11年2月18日 编辑 pif2216 取消关注 关注 私信 有了解WernerEngelmaier这个人么？或有他的课程内容？我们公司想找这个人授课，但又没有联系方法？有谁有么？或有他编写的书籍？ 给TA打赏 共{{data.count}}人 人已打赏
sunjj lv5lv5 11年2月18日 [i=s]本帖最后由sunjj于2011-2-1810:38编辑[/i] [url]http://www.engelmaier.com/cv.html[/url] [url]http://www.engelmaier.com/cv2.html[/url] [url]http://www.bareboard.com/pdfs/TechTalk1.pdf[/url] google一下，资源无限啊！
cyber lv4lv4 11年2月18日 问题是，你们公司希望找他做哪些方面的培训？ 如果你们的可靠性工作已经开展的很不错的话，请一些国外的高手过来还是能够给你们带来巨大的帮助。 但是如果只是请他们过来进行一些基础知识的普及，那可能需要再考虑考虑。毕竟让大学教授去教授初高中，并不是那么合适。
cyber lv4lv4 11年2月18日 WernerEngelmaier,knownintheindustryas’Mr.Reliability,’wasresponsibleforelectronichardwarereliabilityatAT&TBellTelephoneLaboratoriesfor24yearsasa’DistinguishedMemberofTechnicalStaff’beforestartinghisconsultingpracticein1990onreliabilityissuesinelectronicpackagingandinterconnectiontechnology.Inparticular,hedevelopedwidelyusedreliabilitypredictionmodelsforSMTsolderjoints,printedcircuitboardthrough-holesandvias,andflexibleprintedcircuitry. Hehasover210technicalpublicationsandcontributions.Hasgivenseminarson5continents. Along-timememberofIPC,heisthechairmanoftheProductReliabilityCommittee;underhisleadershipand/orwithconsiderablecontributions,industrydocumentsIPC-SM-785“GuidelinesforAcceleratedReliabilityTestingofSurfaceMountSolderAttachments,”IPC-D-279“DesignGuidelinesforReliableSurfaceMountTechnologyPrintedBoardAssemblies,”IPC-TR-484,“ResultsofIPCCopperFoilDuctilityRoundRobinStudy,”IPC-TR-579“RoundRobinReliabilityEvaluationofSmallDiameterPlatedThroughHolesinPrintedWiringBoards,”IPC-9701“PerformanceTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachments,”IPC-9702″MonotonicBendCharacterizationofBoard-LevelInterconnects”andmanyothersweredeveloped. WerneristherecipientofAustria’sTGM-Exner-Medal,IEPS’sElectronicPackagingAchievementAwardandIPCPresident’sAwardforhiscontributionstotheadvancementofElectronicInterconnectionTechnologyandtheElectronicsIndustry.HeisaFellowofIMAPSandhasbeeninductedintotheIPCHallofFame.HeisaregularcolumnistfortheGlobalSMT&Packagingmagazine. WernerEngelmaierholdsMechanicalEngineeringdegreesfromTGM,Vienna,Austria;USC,SC;andMIT. Specialties Electronichardwarereliabilityassessment;Design-for-Reliability(DfR);solderjointreliability;PCBreliability;acceleratedreliabilitytesting;failureandrootcauseanalysis;in-housetraining;expertconsultantinelectronichardwarefailuresandpatentlitigations.
[b]回复[url=pid=87351&ptid=10585]4#[/url][i]sunjj[/i][/b]
非常感谢！
[i=s]本帖最后由sunjj于2011-2-1810:38编辑[/i]
[url]http://www.engelmaier.com/cv.html[/url]
[url]http://www.engelmaier.com/cv2.html[/url]
[url]http://www.bareboard.com/pdfs/TechTalk1.pdf[/url]
google一下，资源无限啊！
问题是，你们公司希望找他做哪些方面的培训？
如果你们的可靠性工作已经开展的很不错的话，请一些国外的高手过来还是能够给你们带来巨大的帮助。
但是如果只是请他们过来进行一些基础知识的普及，那可能需要再考虑考虑。毕竟让大学教授去教授初高中，并不是那么合适。
WernerEngelmaier,knownintheindustryas’Mr.Reliability,’wasresponsibleforelectronichardwarereliabilityatAT&TBellTelephoneLaboratoriesfor24yearsasa’DistinguishedMemberofTechnicalStaff’beforestartinghisconsultingpracticein1990onreliabilityissuesinelectronicpackagingandinterconnectiontechnology.Inparticular,hedevelopedwidelyusedreliabilitypredictionmodelsforSMTsolderjoints,printedcircuitboardthrough-holesandvias,andflexibleprintedcircuitry.
Hehasover210technicalpublicationsandcontributions.Hasgivenseminarson5continents.
Along-timememberofIPC,heisthechairmanoftheProductReliabilityCommittee;underhisleadershipand/orwithconsiderablecontributions,industrydocumentsIPC-SM-785“GuidelinesforAcceleratedReliabilityTestingofSurfaceMountSolderAttachments,”IPC-D-279“DesignGuidelinesforReliableSurfaceMountTechnologyPrintedBoardAssemblies,”IPC-TR-484,“ResultsofIPCCopperFoilDuctilityRoundRobinStudy,”IPC-TR-579“RoundRobinReliabilityEvaluationofSmallDiameterPlatedThroughHolesinPrintedWiringBoards,”IPC-9701“PerformanceTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachments,”IPC-9702″MonotonicBendCharacterizationofBoard-LevelInterconnects”andmanyothersweredeveloped.
WerneristherecipientofAustria’sTGM-Exner-Medal,IEPS’sElectronicPackagingAchievementAwardandIPCPresident’sAwardforhiscontributionstotheadvancementofElectronicInterconnectionTechnologyandtheElectronicsIndustry.HeisaFellowofIMAPSandhasbeeninductedintotheIPCHallofFame.HeisaregularcolumnistfortheGlobalSMT&Packagingmagazine.
WernerEngelmaierholdsMechanicalEngineeringdegreesfromTGM,Vienna,Austria;USC,SC;andMIT.
Specialties
Electronichardwarereliabilityassessment;Design-for-Reliability(DfR);solderjointreliability;PCBreliability;acceleratedreliabilitytesting;failureandrootcauseanalysis;in-housetraining;expertconsultantinelectronichardwarefailuresandpatentlitigations.