谁有EIAJ 标准

谢谢了哈

谢谢了，我也在找这个。

还没有来得及下呢

网站上有部分EIA的标准：[url]http://www.kekaoxing.com/club/thread-1320-1-2.html[/url]

4701系列的暂时没看到，哪位有的话，可以分享一下！

哪位DX有下面的资料:
EIAJED-4701/100
EIAJED-4701/200
EIAJED-4701/300
EIAJED-4701/400
EIAJED-4701/500
拜谢了

有哪个网站可以下载EIAJ的相关标准呢?

我想要的就是4701的标准，谢谢各位了

具体是什么标准，应该说清楚才好找啊！

应该说是具体的什么标准号，这样找起来就会快一点吧。

[quote]原帖由[i]hotleaves[/i]于2007-8-611:11发表[url=pid=5792&ptid=1167][/url]
请问谁有日本EIAJ的标准？谢谢[/quote]

上次在无意中找到很多，可惜没下载！下次在帮您找找！不过最好说出索要标准的一些信息，毕竟标准太多了！

[quote]原帖由[i]hotleaves[/i]于2007-8-611:11发表[url=pid=5792&ptid=1167][/url]
请问谁有日本EIAJ的标准？谢谢[/quote]
[quote]EIAJED-4701/001
StandardofJapanElectronicsandInformationTechnologyIndustriesAssociation
Environmentalandendurancetestmethodsforsemiconductordevices
(General)
1. SCOPEOFAPPLICATION
Thesestandardsprovideforenvironmentaltestmethodsandendurancetestmethodsaimedat
evaluatingtheresistanceandtheenduranceofdiscretesemiconductordevicesandintegratedcircuits
(hereinaftergenericallycalledsemiconductordevices)usedinelectronicequipmentmainlyfor
generalindustrialapplicationsandconsumerapplications,underthevariousenvironmentalconditions
ofvariouskindsthatoccurduringtheiruse,storageandtransportation.
2. DEFINITIONOFTERMS
Thedefinitionofthetechnicaltermsusedinthesestandardsandintherelevantspecificationsare
giveninthefollowings.
(1)Specimen:
Thesemiconductordevicesprovidedforthetests.
(2)Surfacemountingsemiconductordevices:
Thesemiconductordevicesthataremadewiththeobjectofbeingmountedonprintedcircuit
boardsbymeansofthesurfacemountingmethod. HereinaftercalledSMD(SurfaceMounting
Devices).
(3)Equipment:
Theequipmentusedtotestthespecimens.
(4) Materials:
Thematerialsusedtotestthespecimens.
(5)Stepsofprocedure:
Thesequenceaccordingtowhichthevariouskindsoftreatments,measurements,conditionings,
inspections,etc.,requiredforthesakeoftestingthespecimensarecarriedout.
(6)Preliminarytreatment:
Thetreatmentwhichthespecimensaresubmittedtobeforecarryingouttheinitialmeasurements
andtests.
(7)Humidityabsorption:
Thepre-treatment,equivalenttothehumidityabsorptionwhichoccursduringthestorageperiod
untiltheactualmountingbysoldering,whichthespecimensaresubmittedtobeforethe
solderingprocess.
(8)Solderingheat:
Theheatingtreatment,equivalenttotheactualmountingbysoldering,whichthespecimensare
submittedto.
(9) Initialmeasurements:
Thevisualinspectionandtheelectricalandopticalmeasurementswhichthespecimensare
submittedtointhefirstplacebeforecarryingoutthetests.
[/quote]手頭上只有4701的標准，不知道是否用的上