贮存/工作环境温度与试验温度之间的关系 可靠性技术 新手提问 12年3月2日 编辑 wwd0809 取消关注 关注 私信 请教下:在进行高温贮存/工作试验或低温贮存/工作试验时,试样样品的贮存/工作环境温度与试验温度之间是什么关系? 给TA打赏 共{{data.count}}人 人已打赏
lion_lkm lv2lv2 12年3月2日 —AmbientTemperature(Ta).Ambienttemperatureistheroom temperatureoroutsideairtemperaturewhentheunitisoperatingunder normalconditions3.GR-63-CORE,NEBSTMRequirements:Physical Protection,specifiesaroomambientairtemperatureof23°C(73°F) measured1.5m(59in)abovethefloorand400mm(15.8in)infrontofthe equipment.A25°Cambienttemperaturemaybeusedastheairintaketothe equipmentcontainingtheunit.Foroutdoornaturalconvectioncooled equipment,ambienttemperatureisdefinedastheoutsideairtemperature (includingtheeffectsofsolarloading)outsidetheunitbasedonthespecific application. —DeviceOperatingTemperature.Operatingtemperatureforadeviceisthe temperatureinsidetheunitinwhichthedeviceresides.Thistemperatureis definedasthetemperature0.5inchabovethesurfaceofthedevice.When temperaturevariationsacrosstheboardarerelativelyconstant(asinforced aircooledsystems),theaverageboardtemperaturemaybeused.Board temperaturemaybedeterminedbytemperaturesensors,thermocouple measurements,computersimulations,orInfrared(IR)imaging.When temperaturesacrosstheboardvarysignificantly(asinconvectioncooled equipment),devicecasetemperaturesmaybeusedforthemajorhighheat dissipatingdevicesandtheaverageboardtemperatureforallotherdevices. •UsageExample:Thenormalizeddeviceoperatingtemperatureof40°C assumesa25°Cambienttemperatureplusa15°Caverageboard temperatureriseduetolocalheatgeneration. —CaseTemperatures(Tc).Casetemperatureistheexternaldevice temperaturemeasuredoutsidethedevice’scase.Thecasetemperatureof majorheatdissipatingdevicesmaybeusedtodeterminetheoperating temperatureforthesedevices. •UsageExample:Thermalmappingofapowertransistorshowsanaverage casetemperatureof70°C,withanaverageboardtemperatureof50°Cfor allotherdevices. —JunctionTemperatures(Tj).JunctionTemperaturescannotbeused directlywithTable9-1todetermineaTemperatureFactor,sinceTable9-1is calibratedtodeviceoperatingtemperatureorcasetemperatureasdefined above.Tjcanonlybeusedtodeterminefailureratewhenadevice manufacturerprovidesaprovenJunctionTemperature-FailureRateModel.
—AmbientTemperature(Ta).Ambienttemperatureistheroom
temperatureoroutsideairtemperaturewhentheunitisoperatingunder
normalconditions3.GR-63-CORE,NEBSTMRequirements:Physical
Protection,specifiesaroomambientairtemperatureof23°C(73°F)
measured1.5m(59in)abovethefloorand400mm(15.8in)infrontofthe
equipment.A25°Cambienttemperaturemaybeusedastheairintaketothe
equipmentcontainingtheunit.Foroutdoornaturalconvectioncooled
equipment,ambienttemperatureisdefinedastheoutsideairtemperature
(includingtheeffectsofsolarloading)outsidetheunitbasedonthespecific
application.
—DeviceOperatingTemperature.Operatingtemperatureforadeviceisthe
temperatureinsidetheunitinwhichthedeviceresides.Thistemperatureis
definedasthetemperature0.5inchabovethesurfaceofthedevice.When
temperaturevariationsacrosstheboardarerelativelyconstant(asinforced
aircooledsystems),theaverageboardtemperaturemaybeused.Board
temperaturemaybedeterminedbytemperaturesensors,thermocouple
measurements,computersimulations,orInfrared(IR)imaging.When
temperaturesacrosstheboardvarysignificantly(asinconvectioncooled
equipment),devicecasetemperaturesmaybeusedforthemajorhighheat
dissipatingdevicesandtheaverageboardtemperatureforallotherdevices.
•UsageExample:Thenormalizeddeviceoperatingtemperatureof40°C
assumesa25°Cambienttemperatureplusa15°Caverageboard
temperatureriseduetolocalheatgeneration.
—CaseTemperatures(Tc).Casetemperatureistheexternaldevice
temperaturemeasuredoutsidethedevice’scase.Thecasetemperatureof
majorheatdissipatingdevicesmaybeusedtodeterminetheoperating
temperatureforthesedevices.
•UsageExample:Thermalmappingofapowertransistorshowsanaverage
casetemperatureof70°C,withanaverageboardtemperatureof50°Cfor
allotherdevices.
—JunctionTemperatures(Tj).JunctionTemperaturescannotbeused
directlywithTable9-1todetermineaTemperatureFactor,sinceTable9-1is
calibratedtodeviceoperatingtemperatureorcasetemperatureasdefined
above.Tjcanonlybeusedtodeterminefailureratewhenadevice
manufacturerprovidesaprovenJunctionTemperature-FailureRateModel.
[b]回复[url=pid=99197&ptid=12030]1#[/url][i]wwd0809[/i][/b]
问题有点描述不清!太含糊让人无法回答