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yeh lv6lv6 13年1月16日 [quote]admin发表于2013-1-1523:27[url=pid=119752&ptid=13857][/url] 你的速度有点慢哦。可以正常下载啊。下面是附件部分内容摘录，你再试着下一下。若再不行，明天我发你邮箱…[/quote] 正常下载,谢谢！
adminM可靠性网管理员 黄金会员lv6lv6 13年1月15日 [quote]yeh发表于2013-1-1521:29[url=pid=119733&ptid=13857][/url] 下载2次都没成功,请老大确认一下那里出问题了[/quote] 你的速度有点慢哦。可以正常下载啊。下面是附件部分内容摘录，你再试着下一下。若再不行，明天我发你邮箱里. J-STD-030 December2000 GuidelineforSelectionandApplicationofUnderfillMaterial forFlipChipandotherMicropackagesDraft7 UnderfillAdhesivesfor FlipChipApplicationsTaskGroup(5-24f) 1Scope Thisguidelinecoverspolymerbasedunderfillmaterialsintendedforuseinelectronicpackagingassembly applicationstorelievestressonjointsthatinterconnectflipchips(FC),chipscalepackages(CSP)andballgrid arrays(BGA)toaninterconnectingsubstrate. 1.1Purpose Thepurposeofthisdocumentistoestablishevaluationcriterionformaterial,thatwhenusedincombinationwiththe assemblyandjoiningprocesses,willsubstantiallyincreasethethermalfatiguelifeofI/Oconnections(e.g.,solder bumps,goldbumps,conductiveadhesive,combinations)particularlywhenthereiscoefficientofthermalexpansion (CTE)mismatch,substantiallydifferentexpansionvaluesbetweentheflipchiporotherpackageandtheassembly substrate. 1.2Intent Theintentofthedocumentistohelpinidentifyingunderfillmaterialswhosepropertiesarecompatiblewith componentassemblyjointstoreducethermomechanicalstresssothatperformanceoftheassemblyisenhanced.The additionalroleofunderfillisprotectingthedevicefromenvironmentalfactorsandincreasingstrength.Materials usedinunderfillapplicationsshouldnotadverselyaffectdevicereliability(ionicimpurities,alphaemitters)nor degradeelectricalperformance.Evaluationmethodsareprovidedinthedocumentthatareintendedtobeusedfor assessingunderfillmaterialperformanceinspecificapplications.Methodsarealsoincludedthatwillassistin estimatingprocessingtime. 2Applicabledocuments 2.1IPC IPC-T-50TermsandDefinitionsforInterconnectingandPackagingElectronicCircuits IPC-SM-782SurfaceMountDesignandLandPatternStandard IPC-SM785GuidelinesforAcceleratedReliabilityTestingofSurfaceMountSolderAttachments IPC-SM-840QualificationandPerformanceofPermanentSolderMask IPC-TM-650TestMethodsManual TM2.4.28Adhesion,SolderMask(Non-MeltingMetals) TM2.6.1FungusResistancePrintedWiringMaterials TM2.6.3.3SurfaceInsulationResistance,Fluxes TM2.6.14.1ElectrochemicalMigrationResistanceTest 2.2JointIndustryStandard J-STD-004RequirementsforSolderingFluxes J-STD-012ImplementationOfFlipChipandChipScaleTechnology J-STD-020Moisture/ReflowSensitivityClassificationforNon-HermeticSolidStateSurfaceMountDevices J-STD-026SemiconductorDesignStandardforFlipChipApplications J-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps 2.3AmericanSocietyforTestingandMaterials(ASTM) ASTM-D-150StandardTestMethodsforACLossCharacteristicsandPermittivity(DielectricConstant)ofSolid ElectricalInsulation ASTMD257StandardTestMethodsforDCResistanceorConductanceofInsulatingMaterials
sunjj lv5lv5 13年1月15日 J-STD-030GuidelineforSelectionandApplicationofUnderfillMaterialforFlipChipandotherMicropackages 只有一份2000年的草案，仅供参考。 文件下载：J-STD-030 underfill material.pdf 密码或说明： 大小：458KB attach文件下载后改名pdf后缀
[quote]admin发表于2013-1-1523:27[url=pid=119752&ptid=13857][/url]
你的速度有点慢哦。可以正常下载啊。下面是附件部分内容摘录，你再试着下一下。若再不行，明天我发你邮箱…[/quote]
正常下载,谢谢！
[quote]yeh发表于2013-1-1521:29[url=pid=119733&ptid=13857][/url]
下载2次都没成功,请老大确认一下那里出问题了[/quote]
你的速度有点慢哦。可以正常下载啊。下面是附件部分内容摘录，你再试着下一下。若再不行，明天我发你邮箱里.
J-STD-030
December2000
GuidelineforSelectionandApplicationofUnderfillMaterial
forFlipChipandotherMicropackagesDraft7
UnderfillAdhesivesfor
FlipChipApplicationsTaskGroup(5-24f)
1Scope
Thisguidelinecoverspolymerbasedunderfillmaterialsintendedforuseinelectronicpackagingassembly
applicationstorelievestressonjointsthatinterconnectflipchips(FC),chipscalepackages(CSP)andballgrid
arrays(BGA)toaninterconnectingsubstrate.
1.1Purpose
Thepurposeofthisdocumentistoestablishevaluationcriterionformaterial,thatwhenusedincombinationwiththe
assemblyandjoiningprocesses,willsubstantiallyincreasethethermalfatiguelifeofI/Oconnections(e.g.,solder
bumps,goldbumps,conductiveadhesive,combinations)particularlywhenthereiscoefficientofthermalexpansion
(CTE)mismatch,substantiallydifferentexpansionvaluesbetweentheflipchiporotherpackageandtheassembly
substrate.
1.2Intent
Theintentofthedocumentistohelpinidentifyingunderfillmaterialswhosepropertiesarecompatiblewith
componentassemblyjointstoreducethermomechanicalstresssothatperformanceoftheassemblyisenhanced.The
additionalroleofunderfillisprotectingthedevicefromenvironmentalfactorsandincreasingstrength.Materials
usedinunderfillapplicationsshouldnotadverselyaffectdevicereliability(ionicimpurities,alphaemitters)nor
degradeelectricalperformance.Evaluationmethodsareprovidedinthedocumentthatareintendedtobeusedfor
assessingunderfillmaterialperformanceinspecificapplications.Methodsarealsoincludedthatwillassistin
estimatingprocessingtime.
2Applicabledocuments
2.1IPC
IPC-T-50TermsandDefinitionsforInterconnectingandPackagingElectronicCircuits
IPC-SM-782SurfaceMountDesignandLandPatternStandard
IPC-SM785GuidelinesforAcceleratedReliabilityTestingofSurfaceMountSolderAttachments
IPC-SM-840QualificationandPerformanceofPermanentSolderMask
IPC-TM-650TestMethodsManual
TM2.4.28Adhesion,SolderMask(Non-MeltingMetals)
TM2.6.1FungusResistancePrintedWiringMaterials
TM2.6.3.3SurfaceInsulationResistance,Fluxes
TM2.6.14.1ElectrochemicalMigrationResistanceTest
2.2JointIndustryStandard
J-STD-004RequirementsforSolderingFluxes
J-STD-012ImplementationOfFlipChipandChipScaleTechnology
J-STD-020Moisture/ReflowSensitivityClassificationforNon-HermeticSolidStateSurfaceMountDevices
J-STD-026SemiconductorDesignStandardforFlipChipApplications
J-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps
2.3AmericanSocietyforTestingandMaterials(ASTM)
ASTM-D-150StandardTestMethodsforACLossCharacteristicsandPermittivity(DielectricConstant)ofSolid
ElectricalInsulation
ASTMD257StandardTestMethodsforDCResistanceorConductanceofInsulatingMaterials
下载2次都没成功,请老大确认一下那里出问题了
谢谢！sunjj
J-STD-030GuidelineforSelectionandApplicationofUnderfillMaterialforFlipChipandotherMicropackages
只有一份2000年的草案，仅供参考。