求助文件:Lall,P.,Shirgaokar,A.,Arunachalam,D.AndSuhling,J.,“PCRforDerivationofParameterDependencies,Thermo-MechanicalNorris-LandzbergAccelerationFactors,GoldmannFatigueConstantsforLead-freeElectronics.”ProceedingsfromASME2009InterPACKConference,pp.159-170.
ASME 2009 InterPACK Conference, pp. 159-170
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ASME2009InterPACKConference,pp.159-170
ABSTRACT
GoldmannConstantsand[b]Norris-Landzbergaccelerationfactors[/b]forlead-freesoldershavebeendevelopedbasedon
principalcomponentregressionmodels(PCR)forreliabilitypredictionandpartselectionofarea-arraypackaging
architecturesunderthermo-mechanicalloads.ModelshavebeendevelopedinconjunctionwithStepwiseRegression
Methodsforidentificationofthemaineffects.Packagearchitecturesstudiedinclude,BGApackagesmountedon
copper-coreandno-coreprintedcircuitassembliesinharshenvironments.Themodelshavebeendevelopedbasedon
thermo-mechanicalreliabilitydataacquiredoncopper-coreandno-coreassembliesinfourdifferentthermalcyclingconditions.
PackageswithSn3Ag0.5Cusolderalloyinterconnectshavebeenexamined.Themodelshavebeendevelopedbasedon
perturbationofacceleratedtestthermo-mechanicalfailuredata.
DatahasbeengatheredonninedifferentthermalcycleconditionswithSAC305alloys.Thethermalcycleconditions
differintemperaturerange,dwelltimes,maximumtemperatureandminimumtemperaturetoenabledevelopmentofconstants
neededforthelifepredictionandassessmentofaccelerationfactors.GoldmannConstantsandtheNorris-Landzberg
accelerationfactorshavebeenbenchmarkedagainstpreviouslypublishedvalues.Inaddition,modelpredictionshavebeen
validatedagainstvalidationdata-setswhichhavenotbeenusedformodeldevelopment.