EIAJ ED-4701/100~500

购买了付费内容

请问楼主有IEC 60749 全家桶吗

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购买了付费内容

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十分有用

谢谢分享

:lol:lol:lol:lol:lol

:)./……….

好多标准啊，请问EIAJED-4701-B123是在100里面吗？我下载下来看看:)

我都需要呀，谢谢了

有没有103105之类的？

谢谢你的慷慨

这是什么标准？在哪里能找到

感谢！现在要做日本的POS，就是想找这些资料学习下！

感谢！ddddddddddddddddddd

谢啦！

非常感謝~

非常感謝LZ的分享！

xiexieluo

找到了正需要用的标准，多谢楼主:)

不错，都是能下载的资料，感谢LZ的无私奉献。（今天正好在找这些标准）

谢谢楼主！！！

好东西,谢谢楼主!

这个标准找了好久了，谢谢楼主分享。

请问各位高手，这些标准里面重点在测试方法、步骤等，有没有(或从哪里能找到）各项测试的测试样品数量信息，以及Accept/SampleSize信息等等。

这个确实不错，真是谢谢楼主了。

大大我也好想要一份

e-mail:cingchang@hotmail.com

謝謝

附件無法下載啊!!
能否發到[email]chenhaojue.333@163.com[/email]

[size=5][color=blue]site:tsc.jeita.or.jp/tsc/standardfiletype:pdf

[[i]本帖最后由adda于2007-9-2714:30编辑[/i]]

LZ资料好多！羡慕死了！你家隔壁是中国标准仓库吗？:lolLZ强悍死了！非常热心！

ED-4701_500

EIAJED-4701/400

[quote]

Environmentalandendurancetestmethodsfor
semiconductordevices(StresstestI)

TESTMETHOD301
RESISTANCETOSOLDERINGHEATSURFACEMOUNTINGDEVICES(SMD)
1.SCOPE
ThisstandardprovidesforthemethodtoevaluatetosolderingheatofSMDusedinelectronicequipmentforconsumerapplicationandindustrialapplicationingeneral.
2.TESTEQUIPMENT
2.1Hightemperaturefurnace
ThehightemperaturefurnacemustbecapableofkeepingtemperaturespecifiedinSub-clause4.2forlongtime.
2.2Moisturechamber
ThemoisturechambermustbecapableofkeepingtemperatureandrelativehumidityspecifiedinSub-clause4.2forlongtime.Thematerialcomposingthechambermustnotreactunderhighhumidityconditions.Watertobeusedinthetestsmustbedistilledwaterordeionizedwater,withpHfrom6.0to7.2andresistivityof500Wmormoreat23°C.
2.3Infraredreflowsoldering/ConvectionreflowsolderingfurnaceTheinfraredandtheconvectionreflowsolderingfurnacemustbecapabletomeetthetemperatureprofilespecifiedinSub-clause4.4(1).Thetemperatureprofileisspecifiedintermsofthetemperatureoftopsurfaceofthespecimenplacedontheholder(refertoSub-clause2.7).Thetemperatureatthe
topsurfaceofthespecimenshallbemeasuredasshowninFigure1.
Figure1Methodofmeasuringthetemperatureprofileofaspecimen
2.4Vaporphasereflowsolderingfurnace
ThevaporphasereflowsolderingfurnacemustbecapabletomeetthetemperatureprofilespecifiedinSub-clause4.4(2).Thetemperatureprofileisspecifiedintermsofthetemperatureoftopsurfaceofthespecimenplacedontheholder(refertoSub-clause2.7).ThetemperatureatthetopsurfaceofthespecimenshallbemeasuredasshowninFigure1.
2.5Wavesolderingfurnace
ThewavesolderingfurnacemustbecapableofkeepingtemperatureofmoltensolderduringthesolderheatingspecifiedinSub-clause4.4(3).Themoltensoldermustalwaysbeflowed.ThepreheatconditionsinSub-clause4.4(3)(b)arespecifiedintermsofthetemperatureatthetopsurfaceofthespecimenasshowninFigure1.

EIAJED-4701/300kekaoxing.com
2.6Solderbath
ThesolderbathshouldhavecapacityenoughtokeepthetemperatureofmoltensolderwithintheprescribedvaluesevenduringthesolderheatingdescribedinSub-clause4.4(4).ThedippingequipmentshouldbecapabletocontrolthedippingdepthandthedippingtimeoftheterminalsinthemoltensolderasspecifiedinSub-clause4.4(4)(c).
2.7Holders
Unlessotherwisespecified,thematerialoftheholder,whichthespecimenistobeplacedonduring
thesolderheatinginthereflowsolderingandthewavesolderingfurnace,shouldbemadefromglassreinforced
epoxyresin,polyimide,oraluminasubstrate
3.MATERIALS
3.1Perfluorocarbon
UsePerfluorocarbon(perfluoroisobutyrene)orequivalentinvaporphasereflowsolderingfurnaces.
3.2Solder
SolderstobeusedinthistestshouldbethoseonesspecifiedinH60A,H60S,H63AofJISZ3282(SOLDER)orinAPPENDIXBofJISC0050.
3.3Flux
Fluxtobeusedinthistestshouldbe2-propanol(JISK8839)orethanol(ethylalcohol,JISK8101)solutionofrosin(JISK5902)(theconcentrationshouldbefrom10%to35%ofrosinintermsofmassratio,and25%unlessotherwisespecified)orthematerialspecifiedinAPPENDIXCofJISC0050.[/quote]

[quote]
Environmentalandendurancetestmethodsfor
semiconductordevices
(LifetestII)
EstablishedinAugust,2001
Preparedby
TechnicalStandardizationCommitteeonSemiconductorDevices
Publishedby
JapanElectronicsandInformationTechnologyIndustriesAssociation
11,KandaSurugadai3-chome,Chiyoda-ku,Tokyo101-0062,Japan
PrintedinJapan

EIAJED-4701/200
StandardofJapanElectronicsandInformationTechnologyIndustriesAssociationEnvironmentalandendurancetestmethodsforsemiconductordevices(LifetestII)
1.SCOPE
Thesestandardsprovideforenvironmentaltestmethodsandendurancetestmethods(especiallylifetests)aimedatevaluatingtheresistanceandtheenduranceofdiscretesemiconductordevicesandintegratedcircuits(hereinaftergenericallycalledsemiconductordevices)usedinelectronicequipmentmainlyforgeneralindustrialapplicationsandconsumerapplications,underthevariousenvironmentalconditionsofvariouskindsthatoccurduringtheiruse,storageandtransportation.
2.DEFINITIONOFTERMS
ThedefinitionsofthetechnicaltermsusedinthesestandardsandintherelevantspecificationsaregiveninEIAJED-4701/001″Environmentalandendurancetestmethodsforsemiconductordevices(General).”
3.PRECAUTIONS
TheprecautionsusedinthesestandardsandintherelevantspecificationsaregiveninEIAJED-4701/001″Environmentalandendurancetestmethodsforsemiconductordevices(General).”
4.TESTMETHODS
RefertotheAppendixforthetestmethods.
Remarks:
Thevarioustestmethodsarearrangedindependentlyforthesakeofmoreconvenientuseofthesestandards.[/quote]

还是sunjj资料多，一有朋友求助，在你这里几乎都给帮上忙。。:victory: