IEC 61709-2011

IEC61709-2011Electriccomponents–Reliability–Referenceconditionsforfailureratesandstressmodelsforconversion

CONTENTS
FOREWORD……………………………………………………………………………………………………………6
INTRODUCTION………………………………………………………………………………………………………8
1Scope……………………………………………………………………………………………………………….9
2Normativereferences………………………………………………………………………………………….9
3Terms,definitionsandsymbols…………………………………………………………………………..10
3.1Termsanddefinitons…………………………………………………………………………………10
3.2Symbols………………………………………………………………………………………………….12
4Contextandconditions………………………………………………………………………………………13
4.1Failuremodes………………………………………………………………………………………….13
4.2Operatingprofileconsiderations………………………………………………………………….14
4.3Storageconditions……………………………………………………………………………………14
4.4Environmentalconditions…………………………………………………………………………..14
5Genericreferenceconditionsandstressmodels…………………………………………………….16
5.1Recommendedgenericreferenceconditions…………………………………………………16
5.2Genericstressmodels……………………………………………………………………………….17
5.2.1General………………………………………………………………………………………..17
5.2.2Stressfactorforvoltagedependence,U…………………………………………..18
5.2.3Stressfactorforcurrentdependence,I
……………………………………………18
5.2.4Stressfactorfortemperaturedependence,T……………………………………18
5.2.5Environmentalapplicationfactor,E…………………………………………………20
5.2.6Otherfactorsofinfluence………………………………………………………………..21
6Specificreferenceconditionsandstressmodels…………………………………………………….21
6.1Integratedsemiconductorcircuits………………………………………………………………..21
6.1.1Referenceconditions………………………………………………………………………21
6.1.2Stressfactors………………………………………………………………………………..23
6.2Discretesemiconductors……………………………………………………………………………27
6.2.1Referenceconditions………………………………………………………………………27
6.2.2Stressfactors………………………………………………………………………………..28
6.3Optoelectroniccomponents………………………………………………………………………..32
6.3.1Referenceconditions………………………………………………………………………32
6.3.2Stressfactors………………………………………………………………………………..34
6.4Capacitors……………………………………………………………………………………………….38
6.4.1Referenceconditions………………………………………………………………………38
6.4.2Stressfactors………………………………………………………………………………..38
6.5Resistorsandresistornetworks…………………………………………………………………..41
6.5.1Referenceconditions………………………………………………………………………41
6.5.2Stressfactors………………………………………………………………………………..42
6.6Inductors,transformersandcoils…………………………………………………………………43
6.6.1Referenceconditions………………………………………………………………………43
6.6.2Stressfactors………………………………………………………………………………..43
6.7Microwavedevices……………………………………………………………………………………44
6.7.1Referenceconditions………………………………………………………………………44
6.7.2Stressfactors………………………………………………………………………………..45
6.8Otherpassivecomponents…………………………………………………………………………45
6.8.1Referenceconditions………………………………………………………………………45
6.8.2Stressfactors………………………………………………………………………………..45
6.9Electricalconnections………………………………………………………………………………..45
6.9.1Referenceconditions………………………………………………………………………45
6.9.2Stressfactors………………………………………………………………………………..46
6.10Connectorsandsockets…………………………………………………………………………….46
6.10.1Referenceconditions………………………………………………………………………46
6.10.2Stressfactors………………………………………………………………………………..46
6.11Relays…………………………………………………………………………………………………….46
6.11.1Referenceconditions………………………………………………………………………46
6.11.2Stressfactors………………………………………………………………………………..47
6.12Switchesandpush-buttons…………………………………………………………………………49
6.12.1Referenceconditions………………………………………………………………………49
6.12.2Stressfactors………………………………………………………………………………..50
6.13Signalandpilotlamps……………………………………………………………………………….51
6.13.1Referenceconditions………………………………………………………………………51
6.13.2Stressfactors………………………………………………………………………………..51