英文原版电子书 Design for Reliability

文章介绍了产品从构想阶段一直到生产寿命期的可靠性设计的理念、内容和工具等，将可靠性设计提升到一个新的高度。
先将英文版发给大家共享。

[img=483,628]https://www.kekaoxing.com/club/data/attachment/forum/201308/24/152539bp1lpgl5w2271kl9.jpg[/img]

Preface
ListofAcronyms
SectionI:TheStageGateProcess
Authors:DanaCrowe&AlecFeinberg
1.ReliabilityScience
1.1Introduction
1.2ReliabilityDesign:“AStageGateApproach”
1.3DesignforReliabilityTools
1.4ReliabilityVerification
1.5AnalyticalPhysics
1.6TheGoalIsCustomerSatisfaction
2.UnderstandingCustomerRequirements
2.1Introduction
2.2SpecifiedandUnspecifiedRequirements
2.3CostofReliability
2.4Benchmarking
2.5UsingFailureModesandEffectsAnalysistoMeetCustomerRequirements
3.DesignAssessmentReliabilityTesting
3.1Introduction
3.2Four-CornerHALTTesting
3.3DesignAssessmentReliabilityTesting
attheHybridandComponentLevel
3.4Summary
4.DesignMaturityTesting(DMT)
4.1Introduction
4.2OverviewofDMTPlanning
4.3DMTReliabilityObjectives
4.4DMTMethods
4.5ReliabilityandSamplingDistributionModels
4.6SampleSizePlanning
4.7AutomatedAcceleratedTestPlanning
4.8DMTMethodologyandGuidelines

5.ScreeningandMonotoring
5.1Introduction
5.2AchievingReliabilityGrowthinaScreeningProgram
5.3MonitoringandScreeningTools
5.4HighlyAcceleratedStressScreening(HASS)
SectionII:SupportingStageGate
Authors:CarlBunis&PeterErsland
6.SemiconductorProcessReliability
6.1Introduction
6.2OverviewofSemiconductorProcessReliabilityStudies
intheGaAsIndustry
6.3WaferLevelReliabilityTests
6.4Summary
References
7.AnalyticalPhysics
7.1Introduction
7.2PhysicsofFailure
7.3AnalysisFlow
7.4FailureAnalysisExample
7.5AnalyticalTechniques

SectionIII:TopicsinReliability
Authors:DanaCrowe&AlecFeinberg
8.ReliabilityStatisticsSimplified
8.1Introduction
8.2DefinitionsandReliabilityMathematics
8.3FailureRateConcepts
8.4ReliabilityModels
8.5ReliabilityObjectivesandConfidenceTesting
8.6ParametricandCatastrophicMethods
8.7InfluenceofAccelerationFactorsonTestPlanning

AppendixA–AT&TandCommonWeibullModelComparisons
AppendixB–HelpfulMicrosoft®ExcelFunctions
9.ConceptsinAcceleratedTesting
9.1Introduction
9.2CommonSenseGuidelinesforPreventing
AnomalousAcceleratedTestingFailures
9.3TimeAccelerationFactor
9.4ApplicationstoAcceleratedTesting
9.5High-TemperatureOperatingLifeAccelerationModel
9.6Temperature-Humidity-BiasAccelerationModel
9.7TemperatureCycleAccelerationModel
9.8VibrationAccelerationModel
9.9ElectromigrationAccelerationModel
9.10Failure-FreeAcceleratedTestPlanning
9.11Step-StressTesting
9.12DescribingLifeDistributionsasaFunctionofStress
9.13Summary
References
10.AcceleratedReliabilityGrowth
10.1Introduction
10.2EstimatingBenefitswithReliabilityGrowthFixes
10.3AcceleratedReliabilityGrowthMethodology
10.4ApplyingAcceleratedReliabilityGrowthTheory
10.5AssessingReliabilityGrowth
10.6Summary

Appendix–AcceleratedReliabilityGrowthStageGateModel
11.ReliabilityPredictiveModeling
11.1Introduction
11.2SystemReliabilityModeling
11.3CustomerExpectations
11.4VariousMethods
11.5CommonProblems

AppendixA–TabulatedkofnSystemEffectiveFailureRates
AppendixB–RedundancyEquationwithandwithoutRepair
AppendixC–Availability
12.FailureModesandEffectsAnalysis
12.1FailureModesandEffectsAnalysis
12.2FMEAGoalandVision
12.3FMEAConcepts
12.4TypesofFMEAEvaluations
12.5Objectives
12.6AnFMEAExample
12.7ImplementationMethods
AppendixA–GuidetoAssigningFMEAKeyCriteria
AppendixB–FMEAForms
13.EvaluatingProductRisk
13.1Introduction
13.2GoalsofaRiskProgram
13.3ManagingRisksforYourProgram
13.4FourStepstoRiskManagement
13.5GuidelinesforRiskPlanning(Step1)
13.6GuidelinesforRiskAssessment(Step2)
13.7GuidelinesforRiskAnalysis(Step3)
13.8GuidelinesforRiskHandling(Step4)
14.ThermodynamicReliabilityEngineering
14.1ThermodynamicsandReliabilityEngineering
14.2TheSystemandItsEnvironment
14.3TheAgingProcess
14.4AgingDuetoCyclicForce
14.5CorrosionandActivation
14.6Diffusion
14.7TransistorAgingofKeyDeviceParameters
14.8UnderstandingLogarithmic-in-TimeParametricAging
AssociatedwithActivatedProcesses
14.9Summary
References