下载地址:[url=http://www.testres.com/viewthread.php?tid=124&extra=page%3D1]DellLeadfreeQualification[/url]
[size=5][color=#000000]2.0Introduction
[size=5][color=#000000]2.1Purpose/Objective
[size=5][color=#000000][size=11pt][color=#000000][font=TimesNewRoman]ThisdocumentdetailsDellCorporation’srequirementsforqualificationoflead-freeprintedcircuitboardassemblies(PCBAs)supplieddirectlyorindirectlytoDellforuseinDellbrandedproducts.
Theserequirementsaresubjecttochangebasedonfurtherindustrystudyandtechnologicalchangesrelatingtolead-freesoldersandparts.
[size=11pt][font=TimesNewRoman][color=#000000]
[size=11pt][color=#000000][font=TimesNewRoman]ThisqualificationrequirementsdocumentistobeusedinconjunctionwithDellP/ND4394GeneralSpecificationforAllowableLevelsofLead(Pb)inDellProductsandDellP/NM4461whichprovidesPb-freerequirementsforindividualcomponentsusedinDellproducts.
[size=5][color=#000000]2.2Scope
[size=5][color=#000000][size=11pt][color=#000000][font=TimesNewRoman]Therequirementslistedinthisdocumentcoverlead-freealloyssuchasSnCu,SnAgorSnAgCu,withliquidustemperaturesbelow227°C.ExemptionstoPb-freesolderareallowedinDellproductsaccordingtothelatestRoHSdirectives(orasdeterminedbyDell’sEnvironmentalgroup).
[u]TheDellpreferredPb-freealloyisSnAgCuinthecompositionrangeSn(3.0-4.0)Ag(0.5-0.9)Cu.[/u]Lead-freesolderalloyswithmeltingtemperaturegreaterthan227°Corthosecontaining[u]Bi,In,orZnareunacceptable[/u]atthistimeduetoreliability,supply,andorcorrosionconcerns.
PreferredcomponentleadfinishismatteSnover1.3µmNi,howeverothersareacceptableifSnwhiskerriskismitigated.
PreferredboardfinishisimmersionAg(0.15-0.5µmthick).Howeverothersurfacefinisheswillalsobeacceptableincertainapplications(i.e.Ni/Auplated,hightemperatureratedOSPmaterials,immersionSn,etc.).
[size=5][color=#000000]2.3SupportingDocuments
[list][*][font=TimesNewRoman][size=11pt]AgileaccessibleviatheValueChainwebsite([size=11pt][url=https://valuechain.dell.com/][color=#0000ff]https://valuechain.dell.com/[/url][color=#000000])forSuppliers/Vendors.[*][color=#000000][font=TimesNewRoman][size=11pt]GeneralSpecificationforAllowableLevelsofLead(Pb)inDellProducts(DellP/ND4394)locatedinAgile.[size=11pt][*][color=#000000][font=TimesNewRoman][size=11pt]LeadFreeComponentRequirements(DellP/NM4461)locatedinAgile.[size=11pt][*][font=TimesNewRoman][size=11pt]DellRestrictedMaterialSpec(DellP/N6T198)locatedinAgile.[size=11pt][*][font=TimesNewRoman][size=11pt]DellSupplierDeclarationonRestrictedorBannedMaterials(DellP/N7X435)locatedinAgile.[size=11pt][*][size=11pt][color=#000000][font=TimesNewRoman]DirectiveoftheEuropeanParliamentandoftheCouncilontheRestrictionoftheUseofCertainHazardousSubstancesinElectricalandElectronicEquipment,2000/159/COD,October2002.(RoHSDirective)[*][size=11pt][font=TimesNewRoman][color=#000000]DirectiveoftheEuropeanParliamentandoftheCouncilonWasteElectricalandElectronicEquipment,2000/0158/COD,October2002.(WEEEDirective)[*][size=11pt][color=#000000][font=TimesNewRoman]91/157/EECasamendedbyDirective98/101/EC,Batteriesandaccumulatorscontainingcertaindangeroussubstances.[/list][size=5][color=#000000]2.4Procedure
[size=5][color=#000000][size=11pt][color=#000000][font=TimesNewRoman]PriortothestartofqualificationtestingitisexpectedthatthesupplierhasperformedextensiveprocessoptimizationstudiesforPb-free.
DOEsshouldhavebeenruntoselectthebestsolderpastematerialforscreenprintingandsolderjointintegrity.
Optimumreflowparametersandanacceptableprocesswindowshouldbedetermined.
Necessarywavesolderandreworkproceduresshouldbefinalizedandinspectionmethodsdetermined.
Itisexpectedthattheprocessconditionsandmaterialsusedtobuildproductsforqualificationarelocked-infortheforeseeablefuture.
[size=11pt][font=TimesNewRoman][color=#000000]
[size=11pt][color=#000000][font=TimesNewRoman]Thisqualificationdocumentconsistsofthreelevelsoftestingrequirements.
Thequalificationlevelisbasedonproductcomplexity,reliabilityexpectationsandrisktocustomers.
TheLevel1requirementsapplytorelativelysimpleDellcomponents/productswithalowerimpliedriskoffailureduetolead-freematerialsandprocessing.
Level2appliestoproductswithmoderatecomplexityandriskoffailurewhileLevel3ismeanttoaddressmorecomplexDellproductswithhighestexpectedreliability.
[u]Priortoinitiationoftesting,thesuppliershallobtainwrittenconfirmationfromDelloftherequiredqualificationlevelrequiredfortheirproduct.[/u]
[font=TimesNewRoman][size=3][color=#000000]
[size=11pt][color=#000000][font=TimesNewRoman]Priortoanytestingadetailedtestplanshouldbedevelopedandagreeduponbyallinvolvedparties.
Thisplanshouldincludespecifictests,testinglocation,samplesizes,pass/failcriteria,etc.
SamplesizesforcomponentleveltestingandevaluationwillbeaccordingtospecificationunlessspecificallymodifiedbyDell.
ReliabilityevaluationwillbeperformedataDellapprovedtestsiteunlessotherwiseagreedpriortostartoftheproject.
[size=11pt][font=TimesNewRoman][color=#000000]
[size=11pt][color=#000000][font=TimesNewRoman]AcontrolgroupwillberequiredforcomparisonpurposesandmayconsistofthesameproductassembledwithSnPbsolderorapreviousgenerationofSnPbproductofsamecomplexity.
ControlgrouptypewillbedeterminedbymutualagreementbetweenDellandthesupplier.
[size=11pt][font=TimesNewRoman][color=#000000]
[size=11pt][color=#000000][font=TimesNewRoman]Thequalificationcriterialistedare[u]inaddition[/u]tostandardqualificationtestingalreadyexpectedofthesupplierandanyusedbythesuppliertoqualifytheircurrentprocesses.
Eachsupplierisrequiredtosubmitareportdetailingthetestconditions,samplesizes,evaluationproceduresandtestresultsforanytestingthatwasperformedseparatelyfromDellrequirement.
[u][size=11pt][font=TimesNewRoman][color=#000000][/u]
[u][size=11pt][font=TimesNewRoman][color=#000000]AtDelldiscretion,basedoncoverageoftestingalreadyperformedandresultsprovided,allorpartoftherequirementsinthisdocumentmaybemodified.
InsomecasesDellmayrequireadditionaltestingtodeterminetestlimitsandfailuremechanismsassociatedwithcertainhigherriskcomponents.[/u]
[size=5][color=#000000][size=5][color=#000000]3.0QualificationRequirementsforLevel1
[size=5][color=#000000][size=11pt][color=#000000][font=TimesNewRoman]Thislevelisreservedforproductswithlowerperceivedriskoffailureduetointroductionoflead-freematerialsandprocessing.
Productsdeterminedtobeinthislevelarerelativelysimpleandconstructedexclusivelywithcomponentssuchaspassives,through-holeand/orcoarsepitch(>0.5mm)surfacemountleadedpackages.[u]Someexceptionsmayapplybasedonspecificproductapplicationoruseenvironment.[/u]
Toensurethatallmaterialscansurvivetheelevatedtemperaturesexpectedwithleadfreeassembly,allcomponentsmustbeevaluatedindividuallypriortoassembly.
Typesoffailuremechanismsbeingscreenedforincludeheatdamage,moistureinducedcracking/delamination,poorsolderability,andweakjoints.
[[i]本帖最后由cliffcrag于2007-9-2910:08编辑[/i]]
