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reliability lv6lv6 07年12月7日 SUNJJ的资料，下载下来要加上RAR的后缀名哦，摘录一下目录出来！ CHAPTER1-QUALITYASSURANCEFORSEMICONDUCTORDEVICES 1.1ApproachtowardQualityAssurance………………………………………………….10 1.2QualityAssuranceSystemforSemiconductorDevices……………………….16 1.3ProductShippingQualityAssurance………………………………………………….26 1.4ProductLiability(PL)Act……………………………………………………………………29 CHAPTER2-FAILUREMECHANISMS 2.1FailureModesandMechanisms………………………………………………………..34 2.2FailureMechanismsRootedinDesignandtheWaferProcess…………….34 2.3FailureMechanismsRootedintheAssemblyProcess…………………………52 2.4FailureMechanismsRootedintheMountingProcessandOccurringintheField…..59 CHAPTER3-FAILUREANALYSIS 3.1WhatisFailureAnalysis?…………………………………………………………………..98 3.2NecessityofFailureAnalysis……………………………………………………………..99 3.3FailureAnalysis…………………………………………………………………………………99 CHAPTER4-RELIABILITYTESTSANDRELIABILITYPREDICTION 4.1ApproachTowardReliability…………………………………………………………….120 4.2WhatareReliabilityTests…………………………………………………………………121 4.3AcceleratedLifeTests……………………………………………………………………..127 4.4ReliabilityEvaluationbyTEG…………………………………………………………..130 4.5ReliabilityPrediction………………………………………………………………………..136 4.6TestCoverage…………………………………………………………………………………151 4.7ReliabilityRelatedStandards……………………………………………………………152 4 Contents CHAPTER5-NOTESONTHEUSEOFSEMICONDUCTORDEVICES 5.1EvaluationandAssuranceofSolderingHeatResistance…………………164 5.2NotesonHandlingforElectricBreakdown……………………………………..179 5.3NotesonHandlingforMechanicalBreakdown……………………………….191 5.4NotesonHandlingtoPreventThermalBreakdown…………………………197 5.5NotesonHandlingtoPreventMisoperation……………………………………203 5.6NotesonProductSpecifications,Packing,TransportandStorage……205 Appendix 1LotandProductNameIndications………………………………………………….218 2SamplingInspections…………………………………………………………………….223 3SaturatedVaporPressureTable……………………………………………………..228 4BasicReliabilityTheory………………………………………………………………….232 5
sunjj lv5lv5 07年12月7日 是这个吗? <SONYSEMICONDUCTQualityandReliabilityHandbook> 文件下载：HDBK of SONY_Q&R.part1.rar 密码或说明： 大小：1953KB 文件下载：HDBK of SONY_Q&R.part2.rar 密码或说明： 大小：64KB
很不錯的東西謝謝分享下載中
下来看看！！
yibenhaoshua
很好的资料
谢谢sunjj分享
非常感谢楼主的分享
感谢SUNJJ分享！
好东西
最近有要接SONY的產品，先預習一下
好东西，学习以下
没钱，不能下载哦
我怎麼又沒錢
我真是太窮啦
下载后不知为何不能解压，费了好大的劲，下了几次了，几次花光钱
楼主是否可以传给我一份[email]jean_hai222@126.com[/email]
很好的资料可惜我只下载了一个，就没钱了
SUNJJ的资料，下载下来要加上RAR的后缀名哦，摘录一下目录出来！
CHAPTER1-QUALITYASSURANCEFORSEMICONDUCTORDEVICES
1.1ApproachtowardQualityAssurance………………………………………………….10
1.2QualityAssuranceSystemforSemiconductorDevices……………………….16
1.3ProductShippingQualityAssurance………………………………………………….26
1.4ProductLiability(PL)Act……………………………………………………………………29
CHAPTER2-FAILUREMECHANISMS
2.1FailureModesandMechanisms………………………………………………………..34
2.2FailureMechanismsRootedinDesignandtheWaferProcess…………….34
2.3FailureMechanismsRootedintheAssemblyProcess…………………………52
2.4FailureMechanismsRootedintheMountingProcessandOccurringintheField…..59
CHAPTER3-FAILUREANALYSIS
3.1WhatisFailureAnalysis?…………………………………………………………………..98
3.2NecessityofFailureAnalysis……………………………………………………………..99
3.3FailureAnalysis…………………………………………………………………………………99
CHAPTER4-RELIABILITYTESTSANDRELIABILITYPREDICTION
4.1ApproachTowardReliability…………………………………………………………….120
4.2WhatareReliabilityTests…………………………………………………………………121
4.3AcceleratedLifeTests……………………………………………………………………..127
4.4ReliabilityEvaluationbyTEG…………………………………………………………..130
4.5ReliabilityPrediction………………………………………………………………………..136
4.6TestCoverage…………………………………………………………………………………151
4.7ReliabilityRelatedStandards……………………………………………………………152
4
Contents
CHAPTER5-NOTESONTHEUSEOFSEMICONDUCTORDEVICES
5.1EvaluationandAssuranceofSolderingHeatResistance…………………164
5.2NotesonHandlingforElectricBreakdown……………………………………..179
5.3NotesonHandlingforMechanicalBreakdown……………………………….191
5.4NotesonHandlingtoPreventThermalBreakdown…………………………197
5.5NotesonHandlingtoPreventMisoperation……………………………………203
5.6NotesonProductSpecifications,Packing,TransportandStorage……205
Appendix
1LotandProductNameIndications………………………………………………….218
2SamplingInspections…………………………………………………………………….223
3SaturatedVaporPressureTable……………………………………………………..228
4BasicReliabilityTheory………………………………………………………………….232
5
是这个吗?
<SONYSEMICONDUCTQualityandReliabilityHandbook>
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