Dell大厂的PCB认证规程之染色

分享Dell大厂的PCB认证规程之染色标准!:victory:看看我们的NB的设计验证过程!!!

DyeandPryFailureAnalysisProcedure

Engineers/Owners:DellReliabilityOrganization&Component/MaterialsFailureAnalysisLab

DyeandPryProcedure
1.Purpose
ThepurposeofthisdocumentistodescribeindetailtheDyeandPryprocedurethatisrequiredtobeusedonproductsevaluatedforDell.ModificationstothisprocedureareacceptableifsuchmodificationsaresharedwithDellandapproved.
2.MinimumRequirements
1.Machinist’sdye(recommendationisRedSteelDykem).
2.Vacuumpumpandchamber(typicallyamechanicalpumpandbelljar).
3.Stereomicroscopewithdigitalcamera
4.Bakingovencapableof100C
5.Abilitytosectionoutdesiredcomponentsfromboardwithoutexertingexcessivestressonthesolderjoints.
6.Tooltoprythecomponentfromtheboard.
7.Fluxcleaningsolvent.
8.Trainedoperators.
3.Procedure
1.Identifycomponentstobe“DyeandPry”evaluated(consulttestplan).
2.Sectionoutthedesiredcomponentleavingabout1.5to2inchesofboardaroundthepart.
3.CleananyfluxresiduefromaroundtheBGAsolderbumpsusingasolvent(recommendusingaFluxRemoverspray-Isopropylalcoholaloneisnotacceptable).Removinganyfluxresiduesandotherparticles/oilsenablesthedyetomoreeasilypenetratethefractures.FailuretocompletelyremovefluxfromaroundtheBGAbumpsmaypreventinkpenetrationandgivefalseindicationsofagoodsolderjoint.
4.Rinsewellwithwater(followedbyisopropylalcoholifdesired).Allowtocompletelydry.
5.Immersethesectionedsampleinthedye(typicallyinasmalltray).
6.Placethetrayandsectionedsampleintoavacuumchamber.Drawavacuumfor3to4minutes.Partiallyventandreapplyvacuumtothechamberafewtimestoaidindyepenetration.
7.Turnoffvacuumpumpandleavethesampleinthedyeforseveralminutesundervacuum.
8.Ventanyremainingvacuumandremovesample.Allowtheexcessdyetodrainoffthesample.
9.Drythesampleinanovenbybakingat100°Cforupto30minutesdependingontheamountofdyeunderandaroundthedevice.Thedyemustbecompletelydried.Wetdyecansmearduringcomponentremovalresultinginfalseconclusions.

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可靠性技术新手提问

模拟汽车运输振动的标准.

2008-8-25 14:25:00

可靠性技术新手提问

可靠性群

2008-8-25 22:36:16

4 条回复 A文章作者 M管理员
  1. wx_1575862639

    购买了付费内容

  2. frankliu

    請問在染色實驗中怎樣將BGA拆下來是最安全最正確的方法?用起子之類的工具是會伤害到BGAball,造成误判&漏检的可能,各位大俠是使用的什么方法呢?

  3. laichaozhong

    很不错。不过报告中的起子有没有自动的?

  4. jennifor_9

    多谢LZ分享
    看了一下感觉并没有什么NB之处
    1.report中的2,3#图片有出入
    2#图片中BGA部分是裁下来的
    3#图片BGA部分是在主板上的
    2.report中removeBGA时用的是起子样的工具,这样会伤害到BGAball,造成误判&漏检
    3.report中BGA上是否有散热片,如有,在实验前是否需要将其取下(没有说明)
    4.该report也是参照的intel的规范,并没有什么新奇的地方

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