SMIA 可靠度規範

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SMIA1.0Part6:ReliabilitySpecification

1.Overview…….8
1.1Objective…….8
1.2ScopeofApplication…..8
2.GeneralRequirements..8
2.1PerformanceMeasurements.8
2.2StandardMeasurementEnvironment…8
2.3MeasurementSystemAnalysis…..8
2.4TestDataAvailability….9
2.5RequalificationRequirements…….9
3.TestClassification……10
3.1LotAcceptanceTests(GroupA).10
3.2ReliabilityMonitoringTests(GroupB)10
3.3Research&DevelopmentLevelTests(GroupC)…….10
3.4MechanicalTestsforConnectionSystems(GroupD)10
3.5TestsforChanges…….11
4.TestRequirements……11
4.1GroupATests(LotAcceptanceTestsforcameramodule)11
4.1.1A1,ElectricalCharacteristics…….11
4.1.2A2,MechanicalCharacteristics…11
4.1.3A3,OpticalCharacteristics..11
4.1.4A4,ShippingPackagesandLabels…..11
4.2GroupBTests(ReliabilityMonitoringTestsforcameramodule)…….11
4.2.1B1,HighTemperatureOperatingLifeTest/EarlyLifeFailureRateEstimation.11
4.2.2B2,Temperature&HumidityStressTest….12
4.2.3B2.3MechanicalImpactTests….14
4.3GroupCTests(R&DTestsforcameramodule).15
4.3.1C1:DoB1TestAgain..15
4.3.2C2:CombinationTest;TestB2+(B2.2andB2.3)……15
4.3.3C3:HighTemperature.15
4.3.4C4;RandomVibration.15
4.3.5C5:LatchUpTest16
4.3.6C6SteadyStateTemperatureHumidityBiasLifeTest…….16
4.3.7C7HighTemperatureOperatingLifeTest..17
4.3.8C8LowTemperatureOperatingLifeTest…17
4.3.9C9SolarRadiationTest……17
4.4GroupDTests:MechanicalTestsforConnectionSystems(Connectors&FPC)……18
4.4.1D1VibrationTests…….18
4.4.2D2Pull-OutTest(CameraModulefromtheSocketIncaseApplicable)….19
4.4.3D3Peel-OutTestoftheFPC(inCaseApplicable)…..19
4.4.4D4ModuleInsertionTest….19
4.4.5D5FlexBendingTest..19
4.4.6D6ConnectorQualityCheck…….19
4.4.7D7MechanicalImpactTests…….20
5.References…21
5.1IECStandards….21
5.2JEDECStandards……21