不同品牌的同类产品如何通过可靠性试验(加速试验)来对比?

同样是电压监控芯片(一个是IMP809,一个是CAT809),封装都是SOT-23,怎么在短时间内判断出哪个更可靠?求助各位了,指条明路吧~~~:L:L:L

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可靠性技术新手提问

求:GJB 181 飞机供电特性及对用电设备的要求

2009-6-9 15:22:01

可靠性技术可靠性试验

PCB信赖性测试方法择要

2009-6-9 16:54:31

12 条回复 A文章作者 M管理员
  1. 平凡008

    好资料,谢谢分享,长见识了

  2. chenmanwen

    芯片StorageTemperatureRange:–65°Cto160°C
    是不是说就不通电,放在125°C的环境里100h??

  3. chenmanwen

    有没有人能解释一下啊:'(:'(:'(

  4. chenmanwen

    我要测试的芯片Specifiedoverfulltemperaturerange:–40°Cto105°C,HTOL里说要达到125°C,已经超出这种芯片的温度范围了。。。。还能长时间在老化炉里工作吗??

  5. chenmanwen

    HTOListypicallyusedwhenanICispresentthatrequiresmorethanonejunctionorgatetobebiasedfortheoperationofthedevice.Thetemperatureandvoltageconditionsusedinthestresswillvarywiththeproductbeingstressed.However,thetypicalstressambientis150degCwiththebiasappliedequalto80%ofratedvoltagefordiscretedevices.ForIC’s,thegoalistomaintainajunctiontemperatureof125degCor150degC.Testiscontinuouslybiasedbetweenmeasurementintervals.Normalmeasurementintervalsare0hours,504hours(3weeks)and1008hours(6weeks).
    TheHighTemperatureOperatingLife(HTOL)orsteady-statelifetestisperformedtodeterminethereliabilityofdevicesunderoperationathightemperatureconditionsoveranextendedperiodoftime.Itconsistsofsubjectingthepartstoaspecifiedbiasorelectricalstressing,foraspecifiedamountoftime,andataspecifiedhightemperature(essentiallyjustalong-termburn-in).
    Unlikeproductionburn-inwhichacceleratesearlylifefailures,HTOLtestingisappliedtoassessthepotentialoperatinglifetimesofthesamplepopulation(hencetheterm’lifetest’).Itisthereforemoreconcernedwithaccelerationofwear-outfailures.Assuch,lifetestsshouldhavesufficientdurationstoassurethattheresultsarenotduetoearlylifefailuresorinfantmortality.
    ThetestdurationmaybedecreasedbyincreasingtheambienttemperatureforconditionsAtoE(refertoTableI,Method1005).Unlessotherwisespecified,allintermediateandend-pointelectricaltestsmustbeperformedonthepartswithin96hours(24hoursforTa>=175degC)aftertheirremovalfromthespecifiedburn-inconditions.Ifnotspecified,anintermediateelectricaltestingshallbeperformedafter168(+72,-0)hoursandafter504(+168,-0)hoursSinceHTOLissimplylong-termburn-in,itisaccomplishedbyutilizinganyburn-inovencapableofoperatingcontinuouslyoverlongdurations.
    FailuremechanismsacceleratedbyHTOLincludeTime-DependentDielectricBreakdown(TDDB),electromigration,hotcarriereffects,chargeeffects,mobileioniccontamination,etc.
    引用:
    MilStd883,Method1005Specs:
    generally1000hoursmin.at125degC
    max.ratedTcorTa<200degC(ClassB)
    max.ratedTcorTa<175degC(ClassS)
    ConditionA:steady-state,reversebias
    ConditionB:steady-state,forwardbias
    ConditionC:steady-state,power/reversebias
    ConditionD:steady-state,parallelexcitation
    ConditionE:steady-state,ringoscillator
    ConditionF:steady-state,temp.-accelerated

    OtherHTOLConditions(dependingonuse):
    Ta=125C,1000H,maxPdis
    Ta=150C,500H,maxPdis
    125C

  6. chenmanwen

    [quote]原帖由[i]yeh[/i]于2009-6-918:58发表[url=pid=50275&ptid=6336][/url]

    MIN77pcs[/quote]
    为什么最少需要77片?

  7. yeh

    [quote]原帖由[i]chenmanwen[/i]于2009-6-917:38发表[url=pid=50263&ptid=6336][/url]
    这个芯片的工作和电压有关,那电压输入需要变化吗?[/quote]
    原则上不做电压调变
    实施电压加速时则提高试验电压

  8. yeh

    [quote]原帖由[i]sunjj[/i]于2009-6-917:11发表[url=pid=50249&ptid=6336][/url]
    使用高温操作寿命(HTOL)试验.[/quote]
    MIN77pcs

  9. chenmanwen

    这个芯片的工作和电压有关,那电压输入需要变化吗?

  10. chenmanwen

    HTOL?样本量有讲究吗?

  11. sunjj

    使用高温操作寿命(HTOL)试验.

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