HALT Test Plan
1 HALT Test
1.1Test Purpose
The purpose is for detecting weak point & latent defect through various kinds of high stress (voltage, Temperature, Vibration) and root cause failure analysis, corrective action. It improves the reliability of DT MB during its total lifecycle.
1.2 Definitions
HALT: Highly Accelerated Life Test.
Grms: G root mean square.
UUT: Unit Under Test.
UTOL: Upper Temperature Operational Limit. This is the temperature at which the system stops functioning but is able to recover.
LTOL: Lower Temperature Operational Limit. This is the temperature at which the system stops functioning but is able to recover.
UVOL: Upper Voltage Operational Limit. This is the voltage at which the system stops functioning but is able to recover.
LVOL: Lower Voltage Operational Limit. This is the voltage at which the system stops functioning but is able to recover.
VOL: Vibration Operational Limit. The highest vibration level at which the UUT will operate completely correctly.
VDL: Vibration Destruct Limit. The VDL is that vibration level above which the UUT will fail permanently.
1.3Test Equipment
1) Chamber: “Thermotron's” Accelerated Stress Test (AST) System, Model: AST-35
2) DC Power Source: DC Source PSH-3630 or CHROMA 62012P-80-60
3) Thermal Recorder: YOKOGAWA HYBRID RECORDER DR-230
4) Thermocouple: OMEGA T-TYPE THERMOCOUPLE #36
1.4Test Software
1) PC-Doctor V2.9 or latest ver
2) Burn In Test 5.3 or latest ver
3) Maxpower (latest ver) for Intel CPU ThermalNow (latest ver) for AMD CPU
4) IO utility 3.3 or latest ver
1.5Test Sample
1) Sample quantity: 2 units
2) Test Duration: TBD hours
1.6Test Item
1) Voltage Step Stress
2) Temperature Step Stress
3) Thermal Cycle Stress
4) Vibration Step Stress
5) Combine Stress
1.7Test Procedure
1) Voltage Step Stress
A). Upper Voltage Step Stress
1.1) Run PC-Doctor before the test to make sure the UUT functions OK.
1.2) Place the UUT in the chamber’s shelf and set up the test platform.
1.3) Turn off the UUT.
1.4) Power on and boot the UUT with normal voltage of inputting M/B.
1.5) Run Burn-In Test for 15 minutes.
1.6) Adjust DC Voltage by 5% increment at Window Idle model.
1.7) Run Burn-In Test for 15 minutes.
1.8) Repeat 1.6)~1.7) until loss of function occurs or 20% increment is reached.
1.9) Adjust DC Voltage to normal voltage and the UUT operates with no errors.
1.10) The highest voltage achieved with no errors will be defined as UVOL.
1.11) Reference Figure 1 —Graph of upper voltage step stress.
B). Lower Voltage Step Stress
1.12) Adjust DC Voltage by 5% descent at Window Idle model.
1.13) Run Burn-In Test for 15 minutes.
1.14) Repeat 1.11)~1.12) until loss of function occurs or 20% descent is reached.
1.15) Adjust DC Voltage to normal voltage and the UUT operates with no errors.
1.16) The lowest voltage achieved with no errors will be defined as LVOL.
1.17) Reference Figure 2 —Graph of lower voltage step stress.
2) Temperature Step Stress
A). Upper Temperature Step Stress
2.1) Run PC-Doctor before the test to make sure the UUT functions OK.
2.2) Place the UUT in the chamber’s shelf and set up the test platform.
2.3) Turn off the UUT.
2.4) Increase the chamber temperature to 35oC.
2.5) When the UUT reaches thermal equilibrium at the thermal set point, Power on and boot the UUT with normal voltage of inputting M/B.
2.6) Run Burn-In Test for 15 minutes.
2.7) Power off the UUT and increase the product temperature by 10 oC.
2.8) Repeat 2.5)~2.7) until loss of function occurs or 75oC is reached.
2.9) Bring back to room temperature and the UUT operates with no errors.
2.10) The highest temperature achieved with no errors will be defined as UTOL.
2.11) Reference Figure 3 — Graph of upper temperature step stress.
B). Lower Temperature Step Stress
2.12) Run PC-Doctor before the test to make sure the UUT functions OK.
2.13) Place the UUT in the chamber’s shelf and set up the test platform.
2.14) Turn off the UUT.
2.15) Decrease the chamber temperature to 5oC.
2.16) When the UUT reaches thermal equilibrium at the thermal set point, Power on and boot the UUT with normal voltage of inputting M/B.
2.17) Run Burn-In Test for 15 minutes.
2.18) Power off the UUT and decrease the product temperature by 10 oC.
2.19) Repeat 2.15)~2.17) until loss of function occurs or -35oC is reached.
2.20) Bring back to room temperature and the UUT operates with no errors.
2.21) The lowest temperature achieved with no errors will be defined as LTOL.
2.22) Reference Figure 4 — Graph of lower temperature step stress.
3) Thermal Cycle Stress
3.1) Run PC-Doctor before the test to make sure the UUT functions OK.
3.2) Place the UUT in the chamber’s shelf and set up the test platform.
3.3) Turn off the UUT.
3.4) Program the chamber to run the following profile of thermal cycle stresses.
3.5) When the UUT reaches thermal equilibrium at the thermal set point, Power on and boot the UUT with normal voltage of inputting M/B.
3.6) Run Burn-In Test.
3.7) The thermal profile should be run a minimum of 10 complete thermal cycles.
3.8) If any failures occur during the thermal cycle stress process, end the process and remove the UUT from the chamber to perform failure analysis on for the determination of the root cause.
3.9) Reference Figure 5 — Graph of thermal cycle stress.
4) Vibration Step Stress
4.1) Run PC-Doctor before the test to make sure the UUT functions OK.
4.2) Place the UUT in the vibration’s table and set up the test platform.
4.3) Turn off the UUT.
4.4) Start the vibration at 10 Grms input.
4.5) Power on and boot the UUT with normal voltage of inputting M/B.
4.6) Dwell for 15 minutes. Visually check UUT, note observations, and verify functional operation. If a failure occurs, shutdown vibration and run PC-doctor.
4.7) If diagnostic failure is still present with no vibration, document the last vibration level as the Upper Destruct Limit (UDL) and remove from chamber to determine cause of failure.
4.8) If failure is not present, increase the vibration by 5 Grms.
4.9) Repeat 4.6)~4.8) until loss of function occurs or the vibration input level of 45 Grms reached.
4.10) The highest vibration achieved with no errors will be defined as UVOL.
4.11) Reference Figure 6 — Graph of vibration step stress.
5) Combine Stress
5.1) Run PC-Doctor before the test to make sure the UUT functions OK.
5.2) Place the UUT in the chamber’s shelf and set up the test platform.
5.3) Turn off the UUT.
5.4) Program the chamber to run the following profile of combine stress.
5.5) When the UUT reaches thermal equilibrium at the thermal set point, Power on and boot the UUT.
5.6) Run Burn-In Test.
5.7) The combine profile should be run a minimum of 10 complete thermal cycles.
5.8) If any failures occur during the combine stress process, end the process and remove the UUT from the chamber to perform failure analysis on for the determination of the root cause.
5.9) Reference Figure 7 — Graph of combine stress.
1.8Test Criteria
1) Issue defined during pre-test
1.1) Any specified UUT configuration issues including missing hardware (such as missing components), loose hardware, poor component layout, poor component fixture, poor wiring, etc.
1.2) Any UUT defects such as scratches, surface defects, dents, cracks, broken and/or missing plastics, broken and/or missing metal casings, misaligned or poor fit of assemblies, etc.
2) Limits defined during HALT
2.1) Any observed UUT functional failures, abnormal function, or intermittencies.
2.2) Failure of any tested UUT functional features.
2.3) Any component/hardware damage observed during test.
3) Not a “PASS/FAIL” test.
4) Engineering Judgment decide if implement corrective action.
1.9Test Report
The test report shall include:
1) The brand type and model number of the HALT chamber.
2) The brand type and model number meters, accelerometers, thermocouples, or any other probes and their respective locations.
3) Pictures of the setup / fixture should be included for reference.
4) Thermocouple readings.
5) UUT configuration (Hardware and software).
6) Test setup (Equipment and software),
7) All related information collected before, during and after test to facilitate failure analysis.
8) All data collected, test criteria, failure criteria used and test observations shall be reported.
9) All corrective action of failure.
10) Other items.
1.10Appendix
Figure 1: Graph of upper voltage step stress
Figure 2: Graph of lower voltage step stress
Figure 3: Graph of upper temperature step stress
Figure 4: Graph of low temperature step stress
Figure 5: Graph of thermal cycle stress
Figure 6: Graph of vibration step stress
Figure 7: Graph of combine stress
原文附件，HALT交流：MB HALT 测试计划
