ic相關環境及物理測試項目如下11個項測,最後還需功能測試
1)Leadsolderablility可焊性
2)Terminalstrength引出端强度
3)Resistancetosolderingheat耐焊接热
4)Thermalshock(airtoair)热冲击空气
5)Vibration振动
6)Mechanicalshock机械冲击
7)Pressurepot(Autoclave)高压蒸煮
8)Temperatureandhumdity(H3TRB)稳态湿热
9)PowerCyclingON/OFF測試
10)Hightemperaturegatebias(HTGB)高溫偏壓
11)Highttemperaturereversebias(HTRB)高温反偏
以上實驗做完之後需做功能測試,確認材料是否有損壞
我的邮箱是:tw@hongzhan.cc
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IC方面的试验验证方案可参考JESD47
Sunjj正博学多才也
[i=s]本帖最后由sunjj于2010-2-512:28编辑[/i]
JESD22-A100-C CYCLEDTEMPERATUREHUMIDITYBIASLIFETEST
JESD22-A101-B STEADY-STATETEMPERATUREHUMIDITYBIASLIFETEST
JESD22-A102-C ACCELERATEDMOISTURERESISTANCE-UNBIASEDAUTOCLAVE
JESD22-A103-C HIGHTEMPERATURESTORAGELIFE
JESD22-A104-C TEMPERATURECYCLING
JESD22-A105-C POWERANDTEMPERATURECYCLING
JESD22-A106-B THERMALSHOCK
JESD22-A108-C TEMPERATURE,BIAS,ANDOPERATINGLIFE
JESD22-A109-A HERMETICITY
JESD22-A110-B HIGHLYACCELERATEDTEMPERATUREANDHUMIDITYSTRESSTEST(HAST)
JESD22-A118 ACCELERATEDMOISTURERESISTANCE-UNBIASEDHAST
JESD22-A122 PowerCycling
JESD22-B102-D SOLDERABILITY
JESD22-B103-B VIBRATION,VARIABLEFREQUENCY
JESD22-B104-C MECHANICALSHOCK
JESD22-B105-C LEADINTEGRITY
JESD22-B106-C RESISTANCETOSOLDERINGTEMPERATUREFORTHROUGH-HOLEMOUNTEDDEVICES
JESD22-B110-A SUBASSEMBLYMECHANICALSHOCK
JESD22-B111 BOARDLEVELDROPTESTMETHODOFCOMPONENTSFORHANDHELDELECTRONICPRODUCTS