RiAC器件降额标准 Electronic Derating For Optimum Performance
Part Type |
De-rating Parameter |
RAC D-rating Guidelines |
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Severe |
Benign |
NOTES |
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Capacitors |
Fixed Aluminum |
Voltage |
70% |
80% |
% max rated |
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Temperature(℃) |
Tmax – 20℃ |
Tmax – 20℃ |
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Fixed Ceramic |
Voltage |
60% |
70% |
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Temperature(℃) |
Tmax – 10℃ |
Tmax – 10℃ |
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Fixed Mica/Glass |
Voltage |
60% |
70% |
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Temperature(℃) |
Tmax – 10℃ |
Tmax – 10℃ |
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Fixed Paper/Plastic |
Voltage |
60% |
70% |
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Temperature(℃) |
Tmax – 10℃ |
Tmax – 10℃ |
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Fixed Tantalum(non-solid) |
Voltage |
70% |
80% |
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Temperature(℃) |
Tmax – 20℃ |
Tmax – 20℃ |
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Reverse Voltage |
2% |
2% |
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Fixed Tantalum(solid) |
Voltage |
70% |
80% |
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Temperature(℃) |
Tmax – 20℃ |
Tmax – 20℃ |
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Reverse Voltage |
2% |
2% |
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Variable Air |
Voltage |
60% |
70% |
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Temperature(℃) |
Tmax – 10℃ |
Tmax – 10℃ |
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Circuit Breakers |
General Purpose |
Current |
80% |
90% |
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Connectors |
All Types |
Voltage |
70% |
80% |
% of rated DWV |
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Current |
70% |
85% |
% max rated |
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Insert Temperature Limit(℃) |
Tmax – 50℃ |
Tmax – 25℃ |
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Crystals |
SAW |
Input Power(>500MHz) |
13 dBm |
10 dBm |
from max |
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Input Power(<500MHz) |
18 dBm |
13 dBm |
from max |
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Temperature(℃) |
90℃ |
90℃ |
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Diodes |
General Purpose |
Forward Current(IF) |
90% |
<100% |
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(Signal/Switching) |
Reverse Voltage(VR) |
70% |
80% |
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Max Junction Temperature(TJ) |
95℃ |
115℃ |
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Mircrowave |
Power Dissipation(PD) |
90% |
<100% |
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(Schittky/PIN) |
Reverse Voltage(VR) |
70% |
80% |
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Max Junction Temperature(TJ) |
95℃ |
115℃ |
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Power Rectifier |
Forward Current(IF) |
90% |
<100% |
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Reverse Voltage(VR) |
70% |
80% |
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Max Junction Temperature(TJ) |
95℃ |
115℃ |
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Thyristor |
On-State Current(IT) |
90% |
<100% |
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Off-State Voltage(VR) |
70% |
80% |
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Max Junction Temperature(TJ) |
95℃ |
115℃ |
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TVS |
Power Dissipation(PD) |
90% |
<100% |
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Average Current(IO) |
90% |
<100% |
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Max Junction Temperature(TJ) |
95℃ |
115℃ |
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Voltage Regulator |
Power Dissipation(PD) |
90% |
<100% |
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/Reference |
Max Junction Temperature(TJ) |
95℃ |
115℃ |
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Electric Motors |
General Purpose |
Bearing Load |
75% |
75% |
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Temperature(℃) |
Tmax – 25℃ |
Tmax – 25℃ |
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Fans |
General Purpose |
Bearing Load |
75% |
75% |
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Temperature(℃) |
Tmax – 25℃ |
Tmax – 25℃ |
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Filters |
Capacitor |
Voltage |
60% |
70% |
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Temperature(℃) |
Tmax – 10℃ |
Tmax – 10℃ |
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Inductors |
Current DC |
90% |
<100% |
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Temperature(℃) |
Tmax – 25℃ |
Tmax – 25℃ |
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Fuzes |
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Normal Response Current |
80% |
90% |
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Time Delay Current |
50% |
85% |
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Hybrids |
Thick Film Resistor |
Power Dissipation(PD) |
50% |
70% |
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Thin Film Resistor |
Power Dissipation(PD) |
50% |
70% |
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Chip Resistor |
Power Dissipation(PD) |
50% |
70% |
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Chip Capacitor |
Voltage |
60% |
70% |
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General Purpose Diode |
Forward Current(IF) |
90% |
<100% |
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Reverse Voltage(VR) |
70% |
80% |
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Mircrowave Diode |
Power Dissipation(PD) |
90% |
<100% |
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Reverse Voltage(VR) |
70% |
80% |
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Bipolar Transistor |
Power Dissipation(PD) |
90% |
<100% |
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Voltage(VCE) |
70% |
80% |
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Field Effect Transistor |
Power Dissipation(PD) |
90% |
<100% |
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Breakdown Voltage |
90% |
<100% |
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Hybrid Package |
Max Junction Temperature(TJ) |
95℃ |
115℃ |
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Lamp |
Incandescent |
Voltage |
94% |
94% |
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Temperature(℃) |
<175℃ |
<175℃ |
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Neon |
Current |
98% |
98% |
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Temperature(℃) |
<150℃ |
<150℃ |
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Magnetics |
Transformer(Audio) |
Surge Current |
90% |
<100% |
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Surge Voltage |
90% |
<100% |
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Hot Spot Temperature(℃) |
Tmax – 25℃ |
Tmax – 25℃ |
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Transformer(Power) |
Surge Current |
90% |
<100% |
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Surge Voltage |
90% |
<100% |
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Hot Spot Temperature(℃) |
Tmax – 25℃ |
Tmax – 25℃ |
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Transformer(Pulse) |
Surge Current |
90% |
<100% |
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Surge Voltage |
90% |
<100% |
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Hot Spot Temperature(℃) |
Tmax – 25℃ |
Tmax – 25℃ |
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Coil(RF) |
DC Current |
90% |
<100% |
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Surge Voltage |
90% |
<100% |
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Hot Spot Temperature(℃) |
Tmax – 25℃ |
Tmax – 25℃ |
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MEMS |
Micro-Electro-Mechanical |
Driving Frequency |
2 |
2 |
Ratio to Resonate Frequency |
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System |
Relative Humidity |
40% – 50% |
40% – 50% |
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Microcircuits |
Silicon Digital |
Fanout |
90% |
<100% |
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(MOS & Bipolar) |
Frequency |
90% |
<100% |
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Output Current |
90% |
<100% |
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Max Junction Temperature(TJ) |
95℃ |
115℃ |
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Silicon Linear |
Power Dissipation(PD) |
90% |
<100% |
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(MOS & Bipolar) |
Output Current |
90% |
<100% |
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Max Junction Temperature(TJ) |
95℃ |
115℃ |
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GaAs Digital |
Max Channel Temperature(TCH) |
105℃ |
125℃ |
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GaAs Linear |
RF Input Power |
90% |
<100% |
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Power Dissipation(PD) |
90% |
<100% |
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Max Channel Temperature(TCH) |
105℃ |
125℃ |
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SiGe Digital |
Max Channel Temperature(TCH) |
95℃ |
115℃ |
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SiGe Linear |
Max Channel Temperature(TCH) |
95℃ |
115℃ |
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Optoelectronics |
Injection Laser Diode |
Power Output |
50% |
75% |
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Max Junction Temperature(TJ) |
95℃ |
115℃ |
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Light Emitting Diode |
Max Junction Temperature(TJ) |
95℃ |
115℃ |
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Photo Diode |
Max Junction Temperature(TJ) |
95℃ |
115℃ |
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Photo Transistor |
Max Junction Temperature(TJ) |
95℃ |
115℃ |
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Fiber Cabel |
Bend Radius |
200% |
200% |
% min. Rating |
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Cable Tension |
50% |
50% |
% Rated Strength |
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Fiber Tension |
20% |
20% |
% Proof Test |
Relays |
General Purpose |
Contact Current |
75% R Load |
90% R Load |
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75% C Load |
90% C Load |
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40% L Load |
75% L Load |
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20% Motor |
30% Motor |
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10% Filament |
20% Filament |
Lamp |
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Contact Power |
50% |
70% |
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Temperature(℃) |
Tmax – 20℃ |
Tmax – 20℃ |
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Resistors |
Fixed Composition |
Power Dissipation(PD) |
50% |
70% |
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Temperature(℃) |
Tmax – 30℃ |
Tmax – 18℃ |
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Fixed Film |
Power Dissipation(PD) |
50% |
70% |
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Temperature(℃) |
Tmax – 40℃ |
Tmax – 24℃ |
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Fixed Wirewound |
Power Dissipation(PD) |
50% |
70% |
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Temperature(℃) |
Tmax – 10℃ |
Tmax – 6℃ |
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Variable Non-Wirewound |
Power Dissipation(PD) |
50% |
70% |
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Temperature(℃) |
Tmax – 52℃ |
Tmax – 31℃ |
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Variable Wirewound |
Power Dissipation(PD) |
50% |
70% |
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Temperature(℃) |
Tmax – 32℃ |
Tmax – 19℃ |
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Switches |
General Purpose |
Contact Current |
75% R Load |
90% R Load |
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75% C Load |
90% C Load |
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40% L Load |
75% L Load |
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20% Motor |
30% Motor |
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10% Filament |
20% Filament |
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Contact Power |
50% |
70% |
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Contact Current(Surge) |
80% |
80% |
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Thermistors |
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Power Dissipation(PD) |
50% |
50% |
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Temperature(℃) |
Tmax – 50℃ |
Tmax – 50℃ |
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Transistors |
Bipolar Junction |
Power Dissipation(PD) |
90% |
<100% |
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Breakdown Voltage(VCE) |
70% |
80% |
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Max Junction Temperature(TJ) |
95℃ |
115℃ |
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FET(Silicon) |
Power Dissipation(PD) |
90% |
<100% |
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Breakdown Voltage(VBR) |
90% |
<100% |
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Max Junction Temperature(TJ) |
95℃ |
115℃ |
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FET(GaAs) |
Power Dissipation(PD) |
90% |
<100% |
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Max Channel Temperature(TCH) |
105℃ |
125℃ |
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Hetro Junction Bipolar |
Power Dissipation(PD) |
90% |
<100% |
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(GaAs) |
Max Channel Temperature(TCH) |
105℃ |
125℃ |
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High Mobility(GaAs) |
Power Dissipation(PD) |
90% |
<100% |
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Max Channel Temperature(TCH) |
105℃ |
125℃ |
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Tubes |
Cathode Ray |
Power Output |
90% |
80% |
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Temperature(℃) |
Tmax – 20℃ |
Tmax – 20℃ |
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Microwave |
Power Output |
80% |
80% |
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Reflection Power |
50% |
50% |
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Duty Cycle |
75% |
75% |
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Temperature(℃) |
Tmax – 20℃ |
Tmax – 20℃ |
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