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电子设备振动分析《VIBRATION ANALYSIS FOR ELECTRONIC EQUIPMENT》

书籍目录1 Introduction
1.1 VibrationSources
1.2 Definitions
1.3 VibrationRepresentation
1.4 DegreesofFreedom
1.5 VibrationModes
1.6 VibrationNodes
1.7 CoupledModes
1.8 Fasteners
1.9 ElectronicEquipmentforAirplanesandMissiles
1.10 ElectronicEquipmentforShipsandSubmarines
1.11 ElectronicEquipmentforAutomobiles,Trucks,andTrains
1.12 ElectronicsforOilDrillingEquipment
1.13 ElectronicsforComputers,Communication,andEntertainment

2 VibrationsofSimpleElectronicSystems
2.1 SingleSpring-MassSystemWithoutDamping
SampleProblem-NaturalFrequencyofaCantileverBeam
2.2 Single-Degree-of-FreedomTorsionalSystems
SampleProblem-NaturalFrequencyofaTorsionSystem
2.3 SpringsinSeriesandParallel
SampleProblem-ResonantFrequencyofaSpringSystem
2.4 RelationofFrequencyandAccelerationtoDisplacement
SampleProblem-NaturalFrequencyandStressinaBeam
2.5 ForcedVibrationswithViscousDamping
2.6 TransmissibilityasaFunctionofFrequency
SampleProblem-RelatingtheResonantFrequencytotheDynamicDisplacement
2.7 MultipleSpring-MassSystemsWithoutDamping
SampleProblem-ResonantFrequencyofaSystem

3 ComponentLeadWireandSolderJointVibrationFatigueLife
3.1 Introduction
3.2 VibrationProblemswithComponentsMountedHighAbovethePCB
SampleProblem-VibrationFatigueLifeintheWiresofaTO-5Transistor
3.3 VibrationFatigueLifeinSolderJointsofaTO-5Transistor
3.4 RecommendationstoFixtheWireVibrationProblem
3.5 DynamicForcesDevelopedinTransformerWiresDuringVibration
SampleProblem-DynamicForcesandFatigueLifein
3.6 TransformerLeadWiresRelativeDisplacementsBetweenPCBandComponentProduceLeadWireStrain
SampleProblem-EffectsofPCBDisplacementonHybridReliability

4 BeamStructuresforElectronicSubassemblies
4.1NaturalFrequencyofaUniformBeam
SampleProblem-NaturalFrequenciesofBeams
4.2NonuniformCrossSections
SampleProblem-NaturalFrequencyofaBoxwithNonuniformSections
4.3CompositeBeams

5 ComponentLeadWiresasBents,Frames,andArcs
5.1 ElectronicComponentsMountedonCircuitBoards
5.2 BentwithaLateralLoad-HingedEnds
5.3 StrainEnergy-BentwithHingedEnds
5.4 StrainEnergy-BentwithFixedEnds
5.5 StrainEnergy-CircularArcwithHingedEnds
5.6 StrainEnergy-CircularArcwithFixedEnds
5.7 StrainEnergy-CircularArcsforLeadWireStrainRelief
SampleProblem-AddinganOffsetinaWiretoIncreasetheFatigueLife

6 PrintedCircuitBoardsandFlatPlates
6.1 VariousTypesofPrintedCircuitBoards
6.2 ChangesinCircuitBoardEdgeConditions
6.3 EstimatingtheTransmissibilityofaPrintedCircuitBoard
6.4 NaturalFrequencyUsingaTrigonometricSeries
6.5 NaturalFrequencyUsingaPolynomialSeriesSampleProblem-ResonantFrequencyofaPCB
6.6 NaturalFrequencyEquationsDerivedUsingtheRayleighMethod
6.7 DynamicStressesintheCircuitBoardSampleProblem-VibrationStressesinaPCB
6.8 RibsonPrintedCircuitBoards
6.9 RibsFastenedtoCircuitBoardswithScrews
6.10 PrintedCircuitBoardsWithRibsinTwoDirections
6.11 ProperUseofRibstoStiffenPlatesandCircuitBoards
6.12 QuickWaytoEstimatetheRequiredRibSpacingforCircuitBoards
6.13 NaturalFrequenciesforDifferentPCBShapeswithDifferentSupports
SampleProblem-NaturalFrequencyofaTriangularPCBwithThreePointSupports

7 OctaveRule,Snubbing,andDampingtoIncreasethePCBFatigueLife
7.1 DynamicCouplingBetweenthePCBsandTheirSupportStructures
7.2 EffectsofLooseEdgeGuidesonPlug-inTypePCBs
7.3 DescriptionofDynamicComputerStudyfortheOctaveRule
7.4 TheForwardOctaveRuleAlwaysWorks
7.5 TheReverseOctaveRuleMustHaveLightweightPCBs
SampleProblem-VibrationProblemswithRelaysMountedonPCBs
7.6 ProposedCorrectiveActionforRelays
7.7 UsingSnubberstoReducePCBDisplacementsandStresses
SampleProblem-AddingSnubberstoImprovePCBReliability
7.8 ControllingthePCBTransmissibilitywithDamping
7.9 PropertiesofMaterialDamping
7.10 ConstrainedLayerDampingwithViscoelasticMaterials
7.11 WhyStiffeningRibsonPCBsareOftenBetterthanDamping
7.12 ProblemswithPCBViscoelasticDampers

8 PreventingSinusoidalVibrationFailuresinElectronicEquipment
8.1 Introduction
8.2 EstimatingtheVibrationFatigueLife
SampleProblem-QualificationTestforanElectronicSystem
8.3 ElectronicComponentLeadWireStrainRelief
8.4 DesigningPCBsforSinusoidalVibrationEnvironments
SampleProblem-DeterminingDesiredPCBResonantFrequency
8.5 HowLocationandOrientationofComponentonPCBAffectLife
8.6 HowWedgeClampsAffectthePCBResonantFrequency
SampleProblem-ResonantFrequencyofPCBwithSideWedgeClamps
8.7 EffectsofLoosePCBSideEdgeGuides
SampleProblem-ResonantFrequencyofPCBwithLooseEdgeGuides
8.8 SineSweepThroughaResonance
SampleProblem-FatigueCyclesAccumulatedDuringaSineSweep

9 DesigningElectronicsforRandomVibration
9.1 Introduction
9.2 BasicFailureModesinRandomVibration
9.3 CharacteristicsofRandomVibration
9.4 DifferencesBetweenSinusoidalandRandomVibrations
9.5 RandomVibrationInputCurves
SampleProblem-DeterminingtheInputRMSAccelerationLevel
9.6 RandomVibrationUnits
9.7 ShapedRandomVibrationInputCurves
SampleProblem-InputRMSAccelerationsforSlopedPSDCurves
9.8 RelationBetweenDecibelsandSlope
9.9 IntegrationMethodforObtainingtheAreaUnderaPSDCurve
9.10 FindingPointsonthePSDCurve
SampleProblem-FindingPSDValues
9.11 UsingBasicLogarithmstoFindPointsonthePSDCurve
9.12 ProbabilityDistributionFunctions
9.13 GaussianorNormalDistributionCurve
9.14 CorrelatingRandomVibrationFailuresUsingtheThree-BandTechnique
9.15 RayleighDistributionFunction
9.16 ResponseofaSingle-Degree-of-FreedomSystemtoRandomVibration
SampleProblem-EstimatingtheRandomVibrationFatigueLife
9.17 HowPCBsRespondtoRandomVibration
9.18 DesigningPCBsforRandomVibrationEnvironments
SampleProblem-FindingtheDesiredPCBResonantFrequency
9.19 EffectsofRelativeMotiononComponentFatigueLife
SampleProblem-ComponentFatigueLife
9.20 It’stheInputPSDthatCounts,NottheInputRMSAcceleration
9.21 ConnectorWearandSurfaceFrettingCorrosion
SampleProblem-DeterminingApproximateConnectorFatigueLife
9.22 Multiple-Degree-of-FreedomSystems
9.23 OctaveRuleforRandomVibration
SampleProblem-ResponseofChassisandPCBtoRandomVibration
SampleProblem-DynamicAnalysisofanElectronicChassis
9.24 DeterminingtheNumberofPositiveZeroCrossings
SampleProblem-DeterminingtheNumberofPositiveZeroCrossings

10 AcousticNoiseEffectsonElectronics
10.1 Introduction
SampleProblem-DeterminingtheSoundPressureLevel
10.2 MicrophonicEffectsinElectronicEquipment
10.3 MethodsforGeneratingAcousticNoiseTests
10.4 One-ThirdOctaveBandwidth
10.5 DeterminingtheSoundPressureSpectralDensity
10.6 SoundPressureResponsetoAcousticNoiseExcitation
SampleProblem-FatigueLifeofaSheet-MetalPanelExposedtoAcousticNoise
10.7 DeterminingtheSoundAccelerationSpectralDensity
SampleProblem-AlternateMethodofAcousticNoiseAnalysis

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2010-4-26 13:51:06

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振动试验台设备需求

2010-4-26 21:41:46

32 条回复 A文章作者 M管理员
  4. wx_1575862639

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  5. cybernetics

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  6. wx_1580641546

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  7. zhizhiyong

    好资料，学习了

  8. 小人物_e4Ouw

    谢谢楼主分享！

  9. yeh

    Thankyou,foryoursharingselfishly。

  10. maybey

    下完了，差点漏了一个7.

  11. paaover

    謝謝分享,資料很強

  12. wspeaker

    经典资料，找了很久，谢谢楼主分享:)

  13. dreamerbo

    [quote]doumei发表于2010-4-2617:16[url=pid=73676&ptid=8420][/url]
    13 EffectsofManufacturingMethodsontheReliabilityofElectronics
    13.1 Introduction
    13.2 Typi…[/quote]

    找了很久,谢谢!

  14. kevin_whb

    金币啊。。。。金老大给奖励的东西一定是好东西，忍痛下了
    谢谢LZ

  15. qingfenghuli

    楼主这么好的资料
    大方一点，就不要什么金币了

  16. golden-lu2008

    怎么？还卖钱啊，不厚道！！

  17. weihegeng

    [b]回复[url=pid=73777&ptid=8420]7#[/url][i]doumei[/i][/b]

    为什么？？阅读权限是20？？？？？？我从后面下，到前面才发现下不了！！！
    lz能不能取消权限啊？

  18. gdp1111

    好东西

  19. 百里屠苏

    还是全E文的呀，额，有难度~

  20. ylljinzhi

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  21. cctvwwwmy

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  22. deadxiaoh

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  23. ice_fang

    Well,well,非常强大，真诚感谢！

  24. fanxue3

    终于下完了，差点漏了一个7.

  25. zhs

    我下不了，LZ帮帮忙

  26. Allen_jje

    《VIBRATIONANALYSISFORELECTRONICEQUIPMENT》
    AgoodbookIhavebeenseekingforforalongtime.
    Thankyou,LZ,foryoursharingselfishly。！！！:victory:

  28. admin

    不急，每天上传附件有限大小的，明天楼主再编辑2楼的贴子。把余下的附件一并上传。

    谢谢楼主的热心，。

  29. doumei

    [b]回复[url=pid=73680&ptid=8420]4#[/url][i]rzq200[/i][/b]
    5，6传不上去，新建一个帖子也贴不上去，明天再试传传~

  30. rzq200

    怎么没有5、6，不管怎么说，先谢谢分享。

  31. doumei

    13 EffectsofManufacturingMethodsontheReliabilityofElectronics
    13.1 Introduction
    13.2 TypicalTolerancesinElectronicComponentsandLeadWires
    SampleProblem-EffectsofPCBTolerancesonFrequencyandFatigueLife
    13.3 ProblemsAssociatedwithTolerancesonPCBThickness
    13.4 EffectsofPoorBondingMethodsonStructuralStiffness
    13.5 SolderingSmallAxialLeadedComponentsonThrough-HolePCBs
    13.6 AreasWherePoorManufacturingMethodsHaveBeenKnowntoCauseProblems
    13.7 AvionicIntegrityProgramandAutomotiveIntegrityProgram(AVIP)
    13.8 TheBasicPhilosophyforPerforminganAVIPAnalysis
    13.9 DifferentPerspectivesofReliability

    14. VibrationFixturesandVibrationTesting
    14.1 VibrationSimulationEquipment
    14.2 MountingtheVibrationMachine
    14.3 VibrationTestFixtures
    14.4 BasicFixtureDesignConsiderations
    14.5 EffectiveSpringRatesforBolts
    14.6 BoltPreloadTorque
    SampleProblem-DeterminingDesiredBoltTorque
    14.7 RockingModesandOverturningMoments
    14.8 Oil-FilmSliderTables
    14.9 VibrationFixtureCounterweights
    14.1 ASummaryforGoodFixtureDesign
    14.11 SuspensionSystems
    14.12 MechanicalFuses
    14.13 DistinguishingBendingModesfromRockingModes
    14.14 Push-BarCouplings
    14.15 SliderPlateLongitudinalResonance
    14.16 AccelerationForceCapabilityofShaker
    14.17 PositioningtheServo-ControlAccelerometer
    14.18 MoreAccurateMethodforEstimatingtheTransmissibilityQinStructures
    SampleProblem-TransmissibilityExpectedforaPlug-inPCBVibrationTestingCaseHistories
    14.19 Cross-CouplingEffectsinVibrationTestFixtures
    14.20 ProgressiveVibrationShearFailuresinBoltedStructures
    14.21 VibrationPush-BarCouplerswithBoltsLoadedinShear
    14.22 BoltingPCBCentersTogethertoImproveTheirVibrationFatigueLife
    14.23 VibrationFailuresCausedbyCarelessManufacturingMethods
    14.24 AllegedVibrationFailurethatwasReallyCausedbyDroppingaLargeChassis
    14.25 MethodsforIncreasingtheVibrationandShockCapabilityonExistingSystems

    15 EnvironmentalStressScreeningforElectronicEquipment(ESSEE)
    15.1 Introduction
    15.2 EnvironmentalStressScreeningPhilosophy
    15.3 ScreeningEnvironments
    15.4 ThingsanAcceptableScreenAreExpectedtoDo
    15.5 ThingsanAcceptableScreenAreNotExpectedtoDo
    15.6 ToScreenorNottoScreen,ThatistheProblem
    15.7 PreparationsPriortotheStartofaScreeningProgram
    15.8 CombinedThermalCycling,RandomVibration,andElectricalOperation
    15.9 SeparateThermalCycling,RandomVibration,andElectricalOperation
    15.10 ImportanceoftheScreeningEnvironmentSequence
    15.11 HowDamageCanBeDevelopedinaThermalCyclingScreen
    15.12 EstimatingtheAmountofFatigueLifeUsedUpinaSampleProblem-FatigueLifeUsedUpinVibrationandThermalCyclingScreen

  32. doumei

    [i=s]本帖最后由doumei于2010-4-2617:19编辑[/i]

    11DesigningElectronicsforShockEnvironments
    11.1 Introduction
    11.2 SpecifyingtheShockEnvironment
    11.3 PulseShock
    11.4 Half-SineShockPulseforZeroReboundandFullRebound
    11.5 SampleProblem-Half-SineShock-PulseDropTest
    ResponseofElectronicStructurestoShockPulses
    11.6 ResponseofaSimpleSystemtoVariousShockPulses
    11.7 HowPCBsRespondtoShockPulses
    11.8 DeterminingtheDesiredPCBResonantFrequencyforShock
    SampleProblem-ResponseofaPCBtoaHalf-Sine
    11.9 ResponseofPCBtoOtherShockPulses
    SampleProblem-ShockResponseofaTransformerMountingBracket
    11.10 EquivalentShockPulse
    SampleProblem-ShippingCrateforanElectronicBox
    11.11 LowValuesoftheFrequencyRatioR
    SampleProblem-ShockAmplificationforLow
    11.12 FrequencyRatioRShockIsolators
    SampleProblem-HeatDevelopedinanIsolator
    11.13 InformationRequiredforShockIsolators
    SampleProblem-SelectingaSetofShockIsolators
    11.14 RingingEffectsinSystemswithLightDamping
    11.15 HowTwo-Degree-of-FreedomSystemsRespondtoShock
    11.16 TheOctaveRuleforShock
    11.17 VelocityShock
    SampleProblem-DesigningaCabinetforVelocityShock
    11.18 NonlinearVelocityShock
    SampleProblem-CushioningMaterialforaSensitiveElectronicBox
    11.19 ShockResponseSpectrum
    11.20 HowChassisandPCBsRespondtoShock
    SampleProblem-ShockResponseSpectrumAnalysisforChassisandPCB
    11.21 HowPyrotechnicShockCanAffectElectronicComponents
    SampleProblem-ResonantFrequencyofaHybridDieBondWire
    12 DesignandAnalysisofElectronicBoxes
    12.1 Introduction
    12.2 DifferentTypesofMounts
    12.3 PreliminaryDynamicAnalysis
    12.4 BoltedCovers
    12.5 CoupledModes
    12.6 DynamicLoadsinaChassis
    12.7 BendingStressesintheChassis
    12.8 BucklingStressRatioforBending
    12.9 TorsionalStressesintheChassis
    12.1 BucklingStressRatioforShear
    12.11 MarginofSafetyforBuckling
    12.12 Center-of-GravityMount
    12.13 SimplerMethodforObtainingDynamicForcesandStressesonaChassis

    文件下载：电子设备振动分析.part07.rar
    密码或说明： 大小：1824KB

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