Design in Reliability for Communication Designs

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可靠性技术可靠性设计

Package-related Failure Mechanisms and Attributes

2007-7-1 8:36:23

可靠性技术可靠性设计

MOTOROLA :basic semiconductor thermal measurement

2007-7-1 9:02:19

6 条回复 A文章作者 M管理员
  1. turbots

    这个总结好呀

  2. tmbob

    Thankyouforyourselflesscontribution!o(∩_∩)o…

  3. timeline

    啊,谢谢啊!!!!

  4. bluech

    呵呵,谢谢。

  5. 小小

    我帮LZ把文章内的基本摘要拷出来吧。

    ABSTRACT

    Silicondesignimplementationhasbecomeincreasinglycomplexwiththedeepsubmicrontechnologiessuchas90nmandbelow.It
    iscommontoseemultipleprocessorcores,severaltypesofmemories,I/Os,complexanalogcircuitsandsynthesizedlogicon
    thesamechip.SophisticatedIPintegrationtechniquesareneededinordertorealizetoday’scomplexsystems-on-chip(SoC).Also,
    withtheexplosivegrowthinthecommunicationssemiconductormarket,ensuringproductreliabilitytomeetreliabilitygoalsand
    achievegoodyieldisofsignificantconcern.Thispaperisintendedtobringtheinherentchallengesinthereliabilitydomainandsome
    oftheeffectivetechniquescurrentlyusedintheEDAworldtomeetthesechallenges.Wealsodiscusstheneedfordevelopingnew
    methodstoaddresstheupcomingchallengesinultra-deepsubmicrondesignenvironment.

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