常用可靠性测试规范
电子产品常用的工业级可靠性测试可分为以下几类
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环境应力测试
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电测试
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机械应力测试
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综合测试
环境应力测试规范
| 1 | 环境应力测试规范 | 标准说明 |
| 1.01 | 上电温湿度循环寿命测试 | JESD22-A100-B Cycled Temperature-Humidity-Bias Life Test |
| 1.02 | 上电温湿度稳态寿命测试 | JESD22-A101-B Steady State Temperature Humidity Bias Life Test |
| 1.03 | 高加速蒸煮测试 | JESD22-A102-C Accelerated Moisture Resistance -Unbiased Autoclave |
| 1.04 | 高温储存寿命测试 | JESD22-A103-A Test Method A103-A High Temperature Storage Life |
| 1.05 | 高温储存寿命测试 | JESD22-A103-B High Temperature Storage Life |
| 1.06 | 温度循环 | JESD22-A104-B Temperature Cycling |
| 1.07 | 上电和温度循环(TC) | EIA/JESD22-A105-B Test Method A105-B Power and Temperature Cycling |
| 1.08 | 热冲击 | JESD22-A106-A Test Method A106-A Thermal Shock |
| 1.09 | 盐雾测试 | JESD22-A107-A Salt Atmosphere |
| 1.1 | 高温环境条件下的工作寿 命测试 |
JESD22-A108-B Temperature, Bias, and Operating Life |
| 1.11 | 高加速寿命测试 | JESD22-A110-B Test Method A110-B Highly-Accelerated Temperature and Humidity Stress Test (HAST) |
| 1.12 | 非密封表贴器件在可靠性 测试以前的预处理 |
JESD22-A113-B Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing |
| 1.13 | 不上电的高加速湿气渗透 测试 |
JESD22-A118 Accelerated Moisture Resistance – Unbiased HAST |
| 1.14 | 插接器件的抗焊接温度测 试 |
JESD22-B106-B Test Method B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices |
| 1.15 | 集成电路压力测试规范 | EIA/JESD47 Stress-Test-Driven Qualification of Integrated Circuits |
| 1.16 | 温度循环 | JESD22-A104C Temperature Cycling |
电测试规范
| 2 | 电测试规范 | |
| 2.01 | 人体模型条件下的静电放 电敏感度测试 |
JESD22-A114-B Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM) |
| 2.02 | 机器模型条件下的静电放 电敏感度测试 |
EIA/JESD22-A115-A Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM) |
| 2.03 | EEPROM 的擦涂和数据保 存测试 |
JESD22-A117 Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Test |
| 2.04 | 集成电路器件闩锁测试 | EIA/JESD78 IC Latch-Up Test |
| 2.05 | 微电子器件在电荷感应模 型条件下的抗静电放电测 试 |
JESD22-C101-A Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components |
机械应力测试规范
| 3 | 机械应力测试规范 | |
| 3.01 | 振动和扫频测试 | JESD-22-B103-A Test Method B103-A Vibration, Variable Frequency |
| 3.02 | 机械冲击 | JESD22-B104-A Test Method B104-A Mechanical Shock |
| 3.03 | 焊线邦定的剪切测试方法 | EIA/JESD22-B116 Wire Bond Shear Test Method |
| 3.04 | 焊球的剪切测试 | JESD22-B117 BGA Ball Shear BGA |
| 3.05 | 折弯测试 | JESD22B113 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products |
| 3.06 | 掉落测试 | JESD22-B111 Board Level Drop Test Method of Components for Handheld Electronic Products, July 2003 [Text-jd039] |
表 3 机械应力测试项目
综合测试规范
| 4 | 综合测试规范 | |
| 4.01 | 密封性测试 | JEDEC Standard No.22-A109 Test Method A109 Hermeticity |
| 4.02 | 集成电路器件中使用的有 机材料水分扩散和水溶性 测定测试方法 |
Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits |
| 4.03 | 物理尺寸的测量 | JESD22-B100-A Physical Dimensions |
| 4.04 | 外观检查 | JESD22-B101 Test Method B101 External Visual |
| 4.05 | 可焊性测试方法 | EIA/JESD22-B102-C Solderability Test Method |
| 4.06 | 器件管脚的完整性测试 | EIA/JESD22-B105-B Test Method B105-B Lead Integrity |
| 4.07 | 图标的耐久性测试 | EIA/JESD22-B107-A Test Method B107-A Marking Permanency |
| 4.08 | 表贴半导体器件的共面性 测试 |
JESD22-B108 Coplanarity Test for Surface-Mount Semiconductor Devices |
其他规范
| 5 | 其它规范 | |
| 5.01 | 湿度敏感器件的符号和标 识 |
JEP113-B Symbol and Labels for Moisture-Sensitive Devices |
| 5.02 | 硅半导体器件的失效机理 和模型 |
EIA/JEP122 Failure Mechanisms and Models for Silicon Semiconductors Devices |
| 5.03 | 针对非密封表贴半导体器 件的湿度/回流焊敏感度分 级 |
IPC/JEDEC J-STD-020A Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices |
| 5.04 | 湿度/回流焊敏感标贴器件 的处理、包装、运输和使用 的标准 |
IPC/JEDEC J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices |
| 5.05 | 产品文档分类建议 | EIA/JEP103-A Suggested Product-Documentation Classifications and Disclaimers |
| 5.06 | 针对非密封表贴半导体器 件的湿度/回流焊敏感度分 级 Supersedes IPC/JEDEC J-STD-020D August 2007, March 2008 [Text-jd037] |
IPC/JEDEC J-STD-020D.1 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices |
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