The Cycled Temperature-Humidity-Bias Life Test is typically performed on cavity packages, (e.g.,MQUADs, lidded ceramic pin grid arrays, etc.) as an alternative to JESD22-A101 or JESD22-A110.
The Cycled Temperature-humidity –Biased Life Test is performed for the purpose of evaluating the reliability of non-hermetic, packaged solid state devices in humidity environments when surface condensation is likely. It employs conditions of bias, temperature cycling and high humidity that will cause condensation to occur on the device surface. It is useful to determine device surface susceptibility to corrosion and/or dendritic growth.
For most applications test method JESD22-A110 “Highly Accelerated Temperature and Humidity Stress Test (HAST)” or JESD22-A101 “Steady State Temperature, Humidity, Biased Life Test” is preferred.
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