sunjj 发表于 2007-8-30 16:53:54

EIAJ ED-4701/100~500

EIAJED-4701系列标准


StandardofJapanElectronicsandInformationTechnologyIndustriesAssociation
EIAJED-4701/100
Environmentalandendurancetestmethodsfor
semiconductordevices
(LifetestI)

EIAJED-4701/100
TESTMETHOD101
STEADYSTATEOPERATINGLIFE
1.SCOPE
Thisstandardprovidesforthemethodtoevaluatetheenduranceofsemiconductordeviceswhentheyaresubmittedtoelectricstressandthermalstressoflongduration.
Remarks:
Caremustbetakenwhenexecutingthistest,becausethedevicetemperaturemayexceedtheambientpresettemperatureandriseconspicuouslyduetointernallydissipatedheatfromthedevice.
2.TESTEQUIPMENT
Equipmenttobeusedinthistestshouldconsistofachambercapabletokeepthespecifiedtesttemperaturewithinthespecifiedtolerance,thepowersupplycapabletogeneratethespecifiedACorDCvoltages,andtheboardtomakeelectricalcontacttotheterminalsofdevicesundertestwithsocketorothermountingmethod,havingheat.
2.1Circuitry
Thebiasingandoperatingschemesshallconsiderthelimitationsofthedevice.Devicethermalcharacterizationshallbeconsideredtoensurethatthetemperatureof"HotSpots"onthediedoesnotexceedmaximumratedjunctiontemperature(Tjmax).
2.2Devicemounting
Devicemountingshallconsiderthethermalcapacitytominimizeadverseeffectsduringtest.
Remarks:
WhenheSMDismountedonthetestboardforevaluation,therelevantconditions(substratematerial,landsize,solderingmethod,fluxcleaning,etc.)shouldbespecifiedintherelevantspecifications.
2.3Environmentalchamber
Theenvironmentalchambershallbecapableofmaintainingthespecifiedambienttemperaturewithinatoleranceof±5°Cthroughoutthechamberwhileatestisbeingconducted.
3.PROCEDURE
3.1Initialmeasurement
Theinitialmeasurementsshouldbecarriedoutinconformitywiththeitemsandconditionsspecifiedinrelevantspecifications.
3.2Operatingmodeandtestcircuit
Operatingmodeandtestcircuitshouldbeinconformitywiththestipulationsoftherelevantspecifications.
(1)High-TemperatureOperatingLife(HTOL)
TheHTOLtestisconfiguredtoexercisethemaximumnumberofnodesfeasible.Thesupplyvoltagesandclockfrequencyshouldbeinconformitywiththestipulationsoftherelevantspecifications.
(2)High-TemperatureReverse-Bias(HTRB)
TheHTRBtestisconfiguredtoapplythemaximumratedDCreversevoltage(VRMAX)

cliffcrag 发表于 2007-8-30 17:10:00

还是sunjj资料多，一有朋友求助，在你这里几乎都给帮上忙。。:victory:

sunjj 发表于 2007-8-31 08:05:41

EIAJ ED-4701/200


Environmentalandendurancetestmethodsfor
semiconductordevices
(LifetestII)
EstablishedinAugust,2001
Preparedby
TechnicalStandardizationCommitteeonSemiconductorDevices
Publishedby
JapanElectronicsandInformationTechnologyIndustriesAssociation
11,KandaSurugadai3-chome,Chiyoda-ku,Tokyo101-0062,Japan
PrintedinJapan

EIAJED-4701/200
StandardofJapanElectronicsandInformationTechnologyIndustriesAssociationEnvironmentalandendurancetestmethodsforsemiconductordevices(LifetestII)
1.SCOPE
Thesestandardsprovideforenvironmentaltestmethodsandendurancetestmethods(especiallylifetests)aimedatevaluatingtheresistanceandtheenduranceofdiscretesemiconductordevicesandintegratedcircuits(hereinaftergenericallycalledsemiconductordevices)usedinelectronicequipmentmainlyforgeneralindustrialapplicationsandconsumerapplications,underthevariousenvironmentalconditionsofvariouskindsthatoccurduringtheiruse,storageandtransportation.
2.DEFINITIONOFTERMS
ThedefinitionsofthetechnicaltermsusedinthesestandardsandintherelevantspecificationsaregiveninEIAJED-4701/001"Environmentalandendurancetestmethodsforsemiconductordevices(General)."
3.PRECAUTIONS
TheprecautionsusedinthesestandardsandintherelevantspecificationsaregiveninEIAJED-4701/001"Environmentalandendurancetestmethodsforsemiconductordevices(General)."
4.TESTMETHODS
RefertotheAppendixforthetestmethods.
Remarks:
Thevarioustestmethodsarearrangedindependentlyforthesakeofmoreconvenientuseofthesestandards.

sunjj 发表于 2007-9-3 11:32:07

EIAJ ED-4701/300



Environmentalandendurancetestmethodsfor
semiconductordevices(StresstestI)

TESTMETHOD301
RESISTANCETOSOLDERINGHEATSURFACEMOUNTINGDEVICES(SMD)
1.SCOPE
ThisstandardprovidesforthemethodtoevaluatetosolderingheatofSMDusedinelectronicequipmentforconsumerapplicationandindustrialapplicationingeneral.
2.TESTEQUIPMENT
2.1Hightemperaturefurnace
ThehightemperaturefurnacemustbecapableofkeepingtemperaturespecifiedinSub-clause4.2forlongtime.
2.2Moisturechamber
ThemoisturechambermustbecapableofkeepingtemperatureandrelativehumidityspecifiedinSub-clause4.2forlongtime.Thematerialcomposingthechambermustnotreactunderhighhumidityconditions.Watertobeusedinthetestsmustbedistilledwaterordeionizedwater,withpHfrom6.0to7.2andresistivityof500Wmormoreat23°C.
2.3Infraredreflowsoldering/ConvectionreflowsolderingfurnaceTheinfraredandtheconvectionreflowsolderingfurnacemustbecapabletomeetthetemperatureprofilespecifiedinSub-clause4.4(1).Thetemperatureprofileisspecifiedintermsofthetemperatureoftopsurfaceofthespecimenplacedontheholder(refertoSub-clause2.7).Thetemperatureatthe
topsurfaceofthespecimenshallbemeasuredasshowninFigure1.
Figure1Methodofmeasuringthetemperatureprofileofaspecimen
2.4Vaporphasereflowsolderingfurnace
ThevaporphasereflowsolderingfurnacemustbecapabletomeetthetemperatureprofilespecifiedinSub-clause4.4(2).Thetemperatureprofileisspecifiedintermsofthetemperatureoftopsurfaceofthespecimenplacedontheholder(refertoSub-clause2.7).ThetemperatureatthetopsurfaceofthespecimenshallbemeasuredasshowninFigure1.
2.5Wavesolderingfurnace
ThewavesolderingfurnacemustbecapableofkeepingtemperatureofmoltensolderduringthesolderheatingspecifiedinSub-clause4.4(3).Themoltensoldermustalwaysbeflowed.ThepreheatconditionsinSub-clause4.4(3)(b)arespecifiedintermsofthetemperatureatthetopsurfaceofthespecimenasshowninFigure1.

EIAJED-4701/300kekaoxing.com
2.6Solderbath
ThesolderbathshouldhavecapacityenoughtokeepthetemperatureofmoltensolderwithintheprescribedvaluesevenduringthesolderheatingdescribedinSub-clause4.4(4).ThedippingequipmentshouldbecapabletocontrolthedippingdepthandthedippingtimeoftheterminalsinthemoltensolderasspecifiedinSub-clause4.4(4)(c).
2.7Holders
Unlessotherwisespecified,thematerialoftheholder,whichthespecimenistobeplacedonduring
thesolderheatinginthereflowsolderingandthewavesolderingfurnace,shouldbemadefromglassreinforced
epoxyresin,polyimide,oraluminasubstrate
3.MATERIALS
3.1Perfluorocarbon
UsePerfluorocarbon(perfluoroisobutyrene)orequivalentinvaporphasereflowsolderingfurnaces.
3.2Solder
SolderstobeusedinthistestshouldbethoseonesspecifiedinH60A,H60S,H63AofJISZ3282(SOLDER)orinAPPENDIXBofJISC0050.
3.3Flux
Fluxtobeusedinthistestshouldbe2-propanol(JISK8839)orethanol(ethylalcohol,JISK8101)solutionofrosin(JISK5902)(theconcentrationshouldbefrom10%to35%ofrosinintermsofmassratio,and25%unlessotherwisespecified)orthematerialspecifiedinAPPENDIXCofJISC0050.

sunjj 发表于 2007-9-4 16:53:31

EIAJED-4701/400

sunjj 发表于 2007-9-5 11:30:50

ED-4701_500

passway 发表于 2007-9-5 12:04:02

LZ资料好多！羡慕死了！你家隔壁是中国标准仓库吗？:lolLZ强悍死了！非常热心！

adda 发表于 2007-9-27 14:28:20

site:tsc.jeita.or.jp/tsc/standardfiletype:pdf

[本帖最后由adda于2007-9-2714:30编辑]

chenhaojue 发表于 2008-5-15 11:26:50

附件無法下載

附件無法下載啊!!
能否發到chenhaojue.333@163.com

cingchang 发表于 2008-5-20 16:35:34

大大我也好想要一份

e-mail:cingchang@hotmail.com

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