Betty_ge 发表于 2013-6-8 18:29:57

附上英文JD，

Jobdescription:
*DevelopOn-Going-Reliabilitytesttomonitoringmassproduction.
*Debugthefailureandengagewithdesignteammemberstoworkoutsolution.
*EngagewithdesignengineerstoimplementDfR(DesignforReliability).
*Engagewithprogramteammemberstodefineproductspecificationmappingcustomer’srequirements.
*DevelopDFMEAtoidentifyproductriskandmitigationplaninfrontenddesign.
*EvaluateproductfunctionalperformancebytestingorFEA.
*Developmentandimplementationofmethodologies/techniquestoenhanceproductreliability.
*Workwithteammemberondesignimprovementbasedonanalysesresultsandeffectivelycommunicateimprovements,testplansetcwithmanufacturingpartners.
*WorkwithdesignengineertoidentifyCriticaltoFunction/CriticaltoQualityparameters.

Requirements:
*Master/DegreeinMechanical/materialorphysics
*Totalworkexperience8-12years(inclusive3-5yearsinreliabilityfieldorhardwaretesting)
*FEAsimulationexperienceispreferred
*Solidexperienceinhardwareverification
*Strongstatisticalanalysisskill,familiarwithtoolsasMinitaborWeibull
*UnderstandthePoFandgoodFAskills.
*DFMEAexperience
*GoodcommunicationskillandabletocommunicateinEnglish,
*Goodpaperworkandpresentationskills.
*Teamplayerandgoodsupplier-managementskill
Preference
*Electronicpackagingdesignandtestexperienceanadvantage
*FamiliarwithICpackageprocessandqualification.
*Knowledgeinplasticmechanicalprocessisanadvantage

xingxingbook 发表于 2013-6-8 19:15:41

想去，可惜经历不够，要8年呢；继续努力。

pif2216 发表于 2013-6-9 09:28:09

这要求至少是3种以上工作的知识技能，得拿3份以上工资，看好！

Betty_ge 发表于 2013-6-9 09:44:27

亲爱的论坛朋友们，这个岗位招得很急啊，身边若有合适的朋友请帮忙推荐，有丰厚的回报哇:lol

pif2216 发表于 2013-6-9 10:39:56

MS?FEA是做哪方面？

pif2216 发表于 2013-6-9 10:46:32

看你的英文要求和中文要求出入蛮大的，英文的主要是对IC封装的要求

gouyuning 发表于 2013-6-9 11:20:07

貌似是microsoft要求比较高。不知有多少大神满足要求。

stan2007 发表于 2013-6-9 15:43:25

除了英语口语有点困难，其余都满足。。

danny301 发表于 2013-6-9 16:15:35

工作地点没写出来，要求还是基本满足的

danny301 发表于 2013-6-9 16:17:35

我错了，只看到第二页的英文部分，没注意看第一页的中文，工作地点不合适
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