xujia023 发表于 2014-7-18 10:39:58

New Physical Model for Lifetime Estimation of Power Modules

本帖最后由xujia023于2014-7-1810:41编辑

Abstract--Inthispaperaphysicalmodelforlifetime
estimationofstandardpowermodulesisproposed.The
lifetimepredictionisbasedontheassumptionthatthe
solderinterconnectionsaretheweakestpartofthemodule
assemblyandthatthefailurecauseistheinelastic
deformationenergyaccumulatedwithinthesoldermaterial.
Unlikethewell-knownCoffin-Mansonmodel,theproposed
modelcanbeusedtophysicallyexplainthedependencyof
lifetimeonthevariouspropertiesofatemperatureprofile
i.e.frequency,dwell-ramptime,minimum/maximum
temperature.ThemodelisbasedonClech’salgorithmfor
simulationofstress-strainsolderresponseundercyclical
thermalloadingandonthesolderdeformationmechanism
mapusedtodefinethedominantfailuremechanismunder
observedstress-temperatureconditions.Eitheraccelerated
cyclingtestsorexistingfielddatabasesareneededto
parameterizethemodel.Toverifytheapproach,theresults
ofpowercyclingtestsforahighpowerIGBTmodulefound
inliteratureareappliedandtheimpactsoftwomission
profilesonthemodulelifetimeareexamined.

sunjj 发表于 2014-7-18 14:25:40

请问，你的正文呢。为什么只有一个摘要？？？？？？？？？？？
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