sunjj 发表于 2009-6-9 09:16:33

FIDES guide 2009

FIDESguide2009
May2009
ReliabilityMethodologyforElectronicSystems

sunjj 发表于 2009-6-9 09:33:43

FIDESguide2009ReliabilityMethodologyforElectronicSystems

Introduction
TheFIDESglobalelectronicreliabilityengineeringmethodologyGuide,iscomposedof
twoparts:
•apredictedreliabilityevaluationguide,
•areliabilityprocesscontrolandauditguide.
TheobjectivesoftheFIDESGuidearefirstlytomakearealisticevaluationofthe
reliabilityofelectronicproducts,includinginsystemsthatencountersevereornonaggressive
environments(storage),andsecondlytoprovideaspecifictoolforthe
constructionandcontrolofthisreliability.
Itsmaincharacteristicsare:
•TheexistenceofmodelsbothforElectricalElectronicandElectromagnetic
components,andforelectronicboardsorsomesubassemblies.
•Demonstrationandtakingaccountofalltechnologicalandphysicalfactorsthat
haveanidentifiedroleinreliability.
•Preciselytakingaccountofthelifeprofile.
•Takingaccountofelectrical,mechanicalandthermaloverstresses.
•Takingaccountoffailuresrelatedtothedevelopment,production,operationand
maintenanceprocesses.
•Thepossibilityofmakingadistinctionbetweenseveralsuppliersofasingle
component.
TheFIDESGuidecanbehelpfulfortakingactionondefinitionsandthroughoutthelife
cycleofproductstoimproveandcontrolreliability,throughtheidentificationof
technological,physicalorprocessfactorscontributingtoreliability.

reliab 发表于 2009-6-9 09:45:49

sunjj兄资料真多!多谢

34581243 发表于 2009-6-9 13:32:14

好东西，正要看看！

fanxue3 发表于 2009-6-17 21:49:51

呵呵，很好的资料，谢谢分享。

Eason_Liao 发表于 2009-7-17 19:40:43

请教各立高手帮忙解惑一下

大概看了一下，若套用于面板产业，其内容写的LCDScreen,应该是包含整个萤幕，若只需使用要到模组(module)结束不含系统的话，不知能不能适用，
请教各立高手帮忙解惑一下
~thanks~

xinghang1985 发表于 2009-7-22 15:18:06

谢谢分享

yeh 发表于 2009-7-29 07:27:36

谢谢sunjj兄分享

sparkjsb 发表于 2009-12-2 19:13:49

好东西下了先，谢谢啊

kofung 发表于 2010-5-10 15:26:11

Great,tksforyourkindlyshare
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