Dell Lead free Qualification

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下载地址:DellLeadfreeQualification
2.0Introduction
2.1Purpose/Objective
ThisdocumentdetailsDellCorporation’srequirementsforqualificationoflead-freeprintedcircuitboardassemblies(PCBAs)supplieddirectlyorindirectlytoDellforuseinDellbrandedproducts.
Theserequirementsaresubjecttochangebasedonfurtherindustrystudyandtechnologicalchangesrelatingtolead-freesoldersandparts.


ThisqualificationrequirementsdocumentistobeusedinconjunctionwithDellP/ND4394GeneralSpecificationforAllowableLevelsofLead(Pb)inDellProductsandDellP/NM4461whichprovidesPb-freerequirementsforindividualcomponentsusedinDellproducts.
2.2Scope
Therequirementslistedinthisdocumentcoverlead-freealloyssuchasSnCu,SnAgorSnAgCu,withliquidustemperaturesbelow227°C.ExemptionstoPb-freesolderareallowedinDellproductsaccordingtothelatestRoHSdirectives(orasdeterminedbyDell’sEnvironmentalgroup).
TheDellpreferredPb-freealloyisSnAgCuinthecompositionrangeSn(3.0-4.0)Ag(0.5-0.9)Cu.Lead-freesolderalloyswithmeltingtemperaturegreaterthan227°CorthosecontainingBi,In,orZnareunacceptableatthistimeduetoreliability,supply,andorcorrosionconcerns.
PreferredcomponentleadfinishismatteSnover1.3µmNi,howeverothersareacceptableifSnwhiskerriskismitigated.
PreferredboardfinishisimmersionAg(0.15-0.5µmthick).Howeverothersurfacefinisheswillalsobeacceptableincertainapplications(i.e.Ni/Auplated,hightemperatureratedOSPmaterials,immersionSn,etc.).

2.3SupportingDocuments

• AgileaccessibleviatheValueChainwebsite(https://valuechain.dell.com/)forSuppliers/Vendors.
• GeneralSpecificationforAllowableLevelsofLead(Pb)inDellProducts(DellP/ND4394)locatedinAgile.
• LeadFreeComponentRequirements(DellP/NM4461)locatedinAgile.
• DellRestrictedMaterialSpec(DellP/N6T198)locatedinAgile.
• DellSupplierDeclarationonRestrictedorBannedMaterials(DellP/N7X435)locatedinAgile.
• DirectiveoftheEuropeanParliamentandoftheCouncilontheRestrictionoftheUseofCertainHazardousSubstancesinElectricalandElectronicEquipment,2000/159/COD,October2002.(RoHSDirective)
• DirectiveoftheEuropeanParliamentandoftheCouncilonWasteElectricalandElectronicEquipment,2000/0158/COD,October2002.(WEEEDirective)
• 91/157/EECasamendedbyDirective98/101/EC,Batteriesandaccumulatorscontainingcertaindangeroussubstances.

2.4Procedure
PriortothestartofqualificationtestingitisexpectedthatthesupplierhasperformedextensiveprocessoptimizationstudiesforPb-free.
DOEsshouldhavebeenruntoselectthebestsolderpastematerialforscreenprintingandsolderjointintegrity.
Optimumreflowparametersandanacceptableprocesswindowshouldbedetermined.
Necessarywavesolderandreworkproceduresshouldbefinalizedandinspectionmethodsdetermined.
Itisexpectedthattheprocessconditionsandmaterialsusedtobuildproductsforqualificationarelocked-infortheforeseeablefuture.


Thisqualificationdocumentconsistsofthreelevelsoftestingrequirements.
Thequalificationlevelisbasedonproductcomplexity,reliabilityexpectationsandrisktocustomers.


TheLevel1requirementsapplytorelativelysimpleDellcomponents/productswithalowerimpliedriskoffailureduetolead-freematerialsandprocessing.
Level2appliestoproductswithmoderatecomplexityandriskoffailurewhileLevel3ismeanttoaddressmorecomplexDellproductswithhighestexpectedreliability.
Priortoinitiationoftesting,thesuppliershallobtainwrittenconfirmationfromDelloftherequiredqualificationlevelrequiredfortheirproduct.

Priortoanytestingadetailedtestplanshouldbedevelopedandagreeduponbyallinvolvedparties.
Thisplanshouldincludespecifictests,testinglocation,samplesizes,pass/failcriteria,etc.
SamplesizesforcomponentleveltestingandevaluationwillbeaccordingtospecificationunlessspecificallymodifiedbyDell.
ReliabilityevaluationwillbeperformedataDellapprovedtestsiteunlessotherwiseagreedpriortostartoftheproject.

AcontrolgroupwillberequiredforcomparisonpurposesandmayconsistofthesameproductassembledwithSnPbsolderorapreviousgenerationofSnPbproductofsamecomplexity.
ControlgrouptypewillbedeterminedbymutualagreementbetweenDellandthesupplier.

Thequalificationcriterialistedareinadditiontostandardqualificationtestingalreadyexpectedofthesupplierandanyusedbythesuppliertoqualifytheircurrentprocesses.
Eachsupplierisrequiredtosubmitareportdetailingthetestconditions,samplesizes,evaluationproceduresandtestresultsforanytestingthatwasperformedseparatelyfromDellrequirement.


AtDelldiscretion,basedoncoverageoftestingalreadyperformedandresultsprovided,allorpartoftherequirementsinthisdocumentmaybemodified.
InsomecasesDellmayrequireadditionaltestingtodeterminetestlimitsandfailuremechanismsassociatedwithcertainhigherriskcomponents.
3.0QualificationRequirementsforLevel1
Thislevelisreservedforproductswithlowerperceivedriskoffailureduetointroductionoflead-freematerialsandprocessing.
Productsdeterminedtobeinthislevelarerelativelysimpleandconstructedexclusivelywithcomponentssuchaspassives,through-holeand/orcoarsepitch(>0.5mm)surfacemountleadedpackages.Someexceptionsmayapplybasedonspecificproductapplicationoruseenvironment.
Toensurethatallmaterialscansurvivetheelevatedtemperaturesexpectedwithleadfreeassembly,allcomponentsmustbeevaluatedindividuallypriortoassembly.
Typesoffailuremechanismsbeingscreenedforincludeheatdamage,moistureinducedcracking/delamination,poorsolderability,andweakjoints.



[本帖最后由cliffcrag于2007-9-2910:08编辑]