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最近尝试做可靠性预计,碰到微芯的可靠性报告,求解释.附件如下.
关于报告内测试的解释如下:
DynamicLifeTest
TheDynamiclifetest(DLT)alsoknownastheHighTemperatureOperatingLife(HTOL)isperformedtodeterminethereliabilityofdevicessubjectedtospecificconditionsoveranextendedperiodsoftime.Devicesareexercisedatthemaximumdatasheetoperatingvoltage.Inaddition,anelevatedtemperatureandfunctionalsignalsareusedtoexercisethedeviceinamannersimilartousersystems.Devicesaresubjectedto150Cfor96hours(infant)and408hours(Longterm).Theactualfailurerateexperiencedcouldbeconsiderablylessthanthatcalculatediflowerdevicetemperaturesoccurintheapplicationboard.
DynamicLifeProcessBreakout
TheDynamiclifetest(DLT)alsoknownastheHighTemperatureOperatingLife(HTOL)isperformedtodeterminethereliabilityofdevicessubjectedtospecificconditionsoveranextendedperiodsoftime.Devicesareexercisedatthemaximumdatasheetoperatingvoltage.Inaddition,anelevatedtemperatureandfunctionalsignalsareusedtoexercisethedeviceinamannersimilartousersystems.Devicesaresubjectedto150Cfor96hours(infant)and408hours(Longterm).Theactualfailurerateexperiencedcouldbeconsiderablylessthanthatcalculatediflowerdevicetemperaturesoccurintheapplicationboard.
RetentionBake
Datastorageinapplicabledevicesisdonebydevelopingachargeonthefloatinggatestructureinthememorycell.Chargelossinthiscellstructureresultsinaconversionofzeroestoones.A150°CtemperatureisusedtoacceleratechargelossinthememorycellandmeasurethedataretentionontheEPROMandEEPROMportionsofthecircuitry.Devicessubjectedto175°Caretestedat96hoursand504hours.Thisbakeaccelerateschargelossinthememorycell,and96hoursat175°Cisequivalenttogreaterthan250yearsinthefieldat55°C.Theactualfailurerateexperiencedcouldbeconsiderablylessthanthatcalculatediflowerdevicetemperaturesoccurintheapplicationboard.
疑问是报告内的数据如何算出来的,例如用minitab.
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