Dell大厂的PCB认证规程之染色

golden-lu2008

分享Dell大厂的PCB认证规程之染色标准！看看我们的NB的设计验证过程！！！


DyeandPryFailureAnalysisProcedure

Engineers/OwnersellReliabilityOrganization&Component/MaterialsFailureAnalysisLab

DyeandPryProcedure
1.Purpose
ThepurposeofthisdocumentistodescribeindetailtheDyeandPryprocedurethatisrequiredtobeusedonproductsevaluatedforDell.ModificationstothisprocedureareacceptableifsuchmodificationsaresharedwithDellandapproved.
2.MinimumRequirements
1.Machinist’sdye(recommendationisRedSteelDykem).
2.Vacuumpumpandchamber(typicallyamechanicalpumpandbelljar).
3.Stereomicroscopewithdigitalcamera
4.Bakingovencapableof100C
5.Abilitytosectionoutdesiredcomponentsfromboardwithoutexertingexcessivestressonthesolderjoints.
6.Tooltoprythecomponentfromtheboard.
7.Fluxcleaningsolvent.
8.Trainedoperators.
3.Procedure
1.Identifycomponentstobe“DyeandPry”evaluated(consulttestplan).
2.Sectionoutthedesiredcomponentleavingabout1.5to2inchesofboardaroundthepart.
3.CleananyfluxresiduefromaroundtheBGAsolderbumpsusingasolvent(recommendusingaFluxRemoverspray-Isopropylalcoholaloneisnotacceptable).Removinganyfluxresiduesandotherparticles/oilsenablesthedyetomoreeasilypenetratethefractures.FailuretocompletelyremovefluxfromaroundtheBGAbumpsmaypreventinkpenetrationandgivefalseindicationsofagoodsolderjoint.
4.Rinsewellwithwater(followedbyisopropylalcoholifdesired).Allowtocompletelydry.
5.Immersethesectionedsampleinthedye(typicallyinasmalltray).
6.Placethetrayandsectionedsampleintoavacuumchamber.Drawavacuumfor3to4minutes.Partiallyventandreapplyvacuumtothechamberafewtimestoaidindyepenetration.
7.Turnoffvacuumpumpandleavethesampleinthedyeforseveralminutesundervacuum.
8.Ventanyremainingvacuumandremovesample.Allowtheexcessdyetodrainoffthesample.
9.Drythesampleinanovenbybakingat100°Cforupto30minutesdependingontheamountofdyeunderandaroundthedevice.Thedyemustbecompletelydried.Wetdyecansmearduringcomponentremovalresultinginfalseconclusions.

jennifor_9

多谢LZ分享
看了一下感觉并没有什么NB之处
1.report中的2，3#图片有出入
2#图片中BGA部分是裁下来的
3#图片BGA部分是在主板上的
2.report中removeBGA时用的是起子样的工具，这样会伤害到BGAball，造成误判&漏检
3.report中BGA上是否有散热片，如有，在实验前是否需要将其取下(没有说明)
4.该report也是参照的intel的规范,并没有什么新奇的地方

laichaozhong

很不错。不过报告中的起子有没有自动的？

frankliu

請問在染色實驗中怎樣將BGA拆下來是最安全最正確的方法？用起子之類的工具是會伤害到BGAball，造成误判&漏检的可能，各位大俠是使用的什么方法呢？