很长时间没在论坛发表看法了。这个标准以前我用过,并做了适当的翻译工作,你如果有兴趣,我们可以讨论下。最近看到admin在做FMEA的专题,呵呵,最近刚完成一个FMEA的技术报告,有感兴趣的也可和我讨论。FMEA的标准我差不多全了,只差NASA的,希望那位仁兄能够上传下。
包括IEC60300-3-11,最好是第二版。
如果谁对FMEA,RCM感兴趣,希望我们能够讨论。预计也行。
下周回家,牛年大吉。
ReliabilityPredictionProcedureforElectronicEquipment
TelcordiaTechnologiesSpecialReportSR-332Issue2,September2006
TableofContents
SpecialReportNoticeofDisclaimer..........................iii
ListofFigures......................................viii
ListofTables........................................ix
1Introduction
1.1PurposeandScope..................................1–1
1.2Changes........................................1–2
1.3StructureofthisReport...............................1–2
1.4ParticipantsintheDevelopmentofSR-332,Issue2................1–3
2ReliabilityPredictionsforElectronicEquipment
2.1PurposesofReliabilityPredictions.........................2–1
2.2Definitions.......................................2–2
2.2.1EquipmentDefinitions.............................2–2
2.2.2DefinitionofaFailure.............................2–2
2.2.3DefinitionofFailureRate...........................2–3
2.2.3.1LifeCycleofElectronicEquipment...................2–3
2.2.3.2RPPFailureRatePredictions......................2–4
2.2.3.3FactorsAffectingFailureRates.....................2–4
2.3OutlineofMethods..................................2–6
2.3.1FlowofEarlyLifeFailureRateCalculations.................2–6
2.3.2FlowofSteady-StateFailureRateCalculations...............2–6
2.3.3ItemsandFactorsExcludedfromFailureRateCalculations........2–8
2.3.4GuidanceforDeviceTypes/TechnologiesNotinSection8.........2–8
2.3.5StatisticalConsiderations...........................2–9
2.3.5.1UpperConfidenceLevels........................2–9
2.3.5.2AlternateandSupplementaryMethods.................2–9
2.3.6AutomatedReliabilityPredictionProcedure(ARPP)............2–9
3SteadyStateFailureRatePredictionforDevices
3.1MethodI-D:BlackBoxTechnique..........................3–1
3.2MethodII-D:TechniquesIntegratingLaboratoryData..............3–2
3.2.1WhenLaboratoryTestDevicesHadNoPreviousBurn-in.........3–2
3.2.2WhenLaboratoryTestDevicesHadPreviousBurn-in...........3–3
3.3MethodIII-D:TechniquesIntegratingFieldData.................3–3
3.3.1TotalOperatingHours.............................3–4
3.3.2AdjustmentFactor(V).............................3–5
3.4Examples........................................3–5
3.4.1Example1:MethodI-D,BlackBoxTechnique................3–5
3.4.2Example2:MethodII-D,IntegratingLaboratoryTestData.........3–6
3.4.2.1Example2a:NoBurn-InofLaboratoryTestDevices.........3–6
3.4.2.2Example2b:PreviousBurn-InofLaboratoryTestDevices.....3–7
3.4.3Example3:MethodIII-D,IntegratingFieldData..............3–8
3.4.3.1Example3a:SubjectDeviceIsinTestUnitandOperatedatthe
SameTemperatureandElectricalStress................3–8
...... |