电子设备振动分析《VIBRATION ANALYSIS FOR ELECTRONIC EQUIPMENT》
书籍目录1 Introduction1.1 VibrationSources
1.2 Definitions
1.3 VibrationRepresentation
1.4 DegreesofFreedom
1.5 VibrationModes
1.6 VibrationNodes
1.7 CoupledModes
1.8 Fasteners
1.9 ElectronicEquipmentforAirplanesandMissiles
1.10 ElectronicEquipmentforShipsandSubmarines
1.11 ElectronicEquipmentforAutomobiles,Trucks,andTrains
1.12 ElectronicsforOilDrillingEquipment
1.13 ElectronicsforComputers,Communication,andEntertainment
2 VibrationsofSimpleElectronicSystems
2.1 SingleSpring-MassSystemWithoutDamping
SampleProblem-NaturalFrequencyofaCantileverBeam
2.2 Single-Degree-of-FreedomTorsionalSystems
SampleProblem-NaturalFrequencyofaTorsionSystem
2.3 SpringsinSeriesandParallel
SampleProblem-ResonantFrequencyofaSpringSystem
2.4 RelationofFrequencyandAccelerationtoDisplacement
SampleProblem-NaturalFrequencyandStressinaBeam
2.5 ForcedVibrationswithViscousDamping
2.6 TransmissibilityasaFunctionofFrequency
SampleProblem-RelatingtheResonantFrequencytotheDynamicDisplacement
2.7 MultipleSpring-MassSystemsWithoutDamping
SampleProblem-ResonantFrequencyofaSystem
3 ComponentLeadWireandSolderJointVibrationFatigueLife
3.1 Introduction
3.2 VibrationProblemswithComponentsMountedHighAbovethePCB
SampleProblem-VibrationFatigueLifeintheWiresofaTO-5Transistor
3.3 VibrationFatigueLifeinSolderJointsofaTO-5Transistor
3.4 RecommendationstoFixtheWireVibrationProblem
3.5 DynamicForcesDevelopedinTransformerWiresDuringVibration
SampleProblem-DynamicForcesandFatigueLifein
3.6 TransformerLeadWiresRelativeDisplacementsBetweenPCBandComponentProduceLeadWireStrain
SampleProblem-EffectsofPCBDisplacementonHybridReliability
4 BeamStructuresforElectronicSubassemblies
4.1NaturalFrequencyofaUniformBeam
SampleProblem-NaturalFrequenciesofBeams
4.2NonuniformCrossSections
SampleProblem-NaturalFrequencyofaBoxwithNonuniformSections
4.3CompositeBeams
5 ComponentLeadWiresasBents,Frames,andArcs
5.1 ElectronicComponentsMountedonCircuitBoards
5.2 BentwithaLateralLoad-HingedEnds
5.3 StrainEnergy-BentwithHingedEnds
5.4 StrainEnergy-BentwithFixedEnds
5.5 StrainEnergy-CircularArcwithHingedEnds
5.6 StrainEnergy-CircularArcwithFixedEnds
5.7 StrainEnergy-CircularArcsforLeadWireStrainRelief
SampleProblem-AddinganOffsetinaWiretoIncreasetheFatigueLife
6 PrintedCircuitBoardsandFlatPlates
6.1 VariousTypesofPrintedCircuitBoards
6.2 ChangesinCircuitBoardEdgeConditions
6.3 EstimatingtheTransmissibilityofaPrintedCircuitBoard
6.4 NaturalFrequencyUsingaTrigonometricSeries
6.5 NaturalFrequencyUsingaPolynomialSeriesSampleProblem-ResonantFrequencyofaPCB
6.6 NaturalFrequencyEquationsDerivedUsingtheRayleighMethod
6.7 DynamicStressesintheCircuitBoardSampleProblem-VibrationStressesinaPCB
6.8 RibsonPrintedCircuitBoards
6.9 RibsFastenedtoCircuitBoardswithScrews
6.10 PrintedCircuitBoardsWithRibsinTwoDirections
6.11 ProperUseofRibstoStiffenPlatesandCircuitBoards
6.12 QuickWaytoEstimatetheRequiredRibSpacingforCircuitBoards
6.13 NaturalFrequenciesforDifferentPCBShapeswithDifferentSupports
SampleProblem-NaturalFrequencyofaTriangularPCBwithThreePointSupports
7 OctaveRule,Snubbing,andDampingtoIncreasethePCBFatigueLife
7.1 DynamicCouplingBetweenthePCBsandTheirSupportStructures
7.2 EffectsofLooseEdgeGuidesonPlug-inTypePCBs
7.3 DescriptionofDynamicComputerStudyfortheOctaveRule
7.4 TheForwardOctaveRuleAlwaysWorks
7.5 TheReverseOctaveRuleMustHaveLightweightPCBs
SampleProblem-VibrationProblemswithRelaysMountedonPCBs
7.6 ProposedCorrectiveActionforRelays
7.7 UsingSnubberstoReducePCBDisplacementsandStresses
SampleProblem-AddingSnubberstoImprovePCBReliability
7.8 ControllingthePCBTransmissibilitywithDamping
7.9 PropertiesofMaterialDamping
7.10 ConstrainedLayerDampingwithViscoelasticMaterials
7.11 WhyStiffeningRibsonPCBsareOftenBetterthanDamping
7.12 ProblemswithPCBViscoelasticDampers
8 PreventingSinusoidalVibrationFailuresinElectronicEquipment
8.1 Introduction
8.2 EstimatingtheVibrationFatigueLife
SampleProblem-QualificationTestforanElectronicSystem
8.3 ElectronicComponentLeadWireStrainRelief
8.4 DesigningPCBsforSinusoidalVibrationEnvironments
SampleProblem-DeterminingDesiredPCBResonantFrequency
8.5 HowLocationandOrientationofComponentonPCBAffectLife
8.6 HowWedgeClampsAffectthePCBResonantFrequency
SampleProblem-ResonantFrequencyofPCBwithSideWedgeClamps
8.7 EffectsofLoosePCBSideEdgeGuides
SampleProblem-ResonantFrequencyofPCBwithLooseEdgeGuides
8.8 SineSweepThroughaResonance
SampleProblem-FatigueCyclesAccumulatedDuringaSineSweep
9 DesigningElectronicsforRandomVibration
9.1 Introduction
9.2 BasicFailureModesinRandomVibration
9.3 CharacteristicsofRandomVibration
9.4 DifferencesBetweenSinusoidalandRandomVibrations
9.5 RandomVibrationInputCurves
SampleProblem-DeterminingtheInputRMSAccelerationLevel
9.6 RandomVibrationUnits
9.7 ShapedRandomVibrationInputCurves
SampleProblem-InputRMSAccelerationsforSlopedPSDCurves
9.8 RelationBetweenDecibelsandSlope
9.9 IntegrationMethodforObtainingtheAreaUnderaPSDCurve
9.10 FindingPointsonthePSDCurve
SampleProblem-FindingPSDValues
9.11 UsingBasicLogarithmstoFindPointsonthePSDCurve
9.12 ProbabilityDistributionFunctions
9.13 GaussianorNormalDistributionCurve
9.14 CorrelatingRandomVibrationFailuresUsingtheThree-BandTechnique
9.15 RayleighDistributionFunction
9.16 ResponseofaSingle-Degree-of-FreedomSystemtoRandomVibration
SampleProblem-EstimatingtheRandomVibrationFatigueLife
9.17 HowPCBsRespondtoRandomVibration
9.18 DesigningPCBsforRandomVibrationEnvironments
SampleProblem-FindingtheDesiredPCBResonantFrequency
9.19 EffectsofRelativeMotiononComponentFatigueLife
SampleProblem-ComponentFatigueLife
9.20 It’stheInputPSDthatCounts,NottheInputRMSAcceleration
9.21 ConnectorWearandSurfaceFrettingCorrosion
SampleProblem-DeterminingApproximateConnectorFatigueLife
9.22 Multiple-Degree-of-FreedomSystems
9.23 OctaveRuleforRandomVibration
SampleProblem-ResponseofChassisandPCBtoRandomVibration
SampleProblem-DynamicAnalysisofanElectronicChassis
9.24 DeterminingtheNumberofPositiveZeroCrossings
SampleProblem-DeterminingtheNumberofPositiveZeroCrossings
10 AcousticNoiseEffectsonElectronics
10.1 Introduction
SampleProblem-DeterminingtheSoundPressureLevel
10.2 MicrophonicEffectsinElectronicEquipment
10.3 MethodsforGeneratingAcousticNoiseTests
10.4 One-ThirdOctaveBandwidth
10.5 DeterminingtheSoundPressureSpectralDensity
10.6 SoundPressureResponsetoAcousticNoiseExcitation
SampleProblem-FatigueLifeofaSheet-MetalPanelExposedtoAcousticNoise
10.7 DeterminingtheSoundAccelerationSpectralDensity
SampleProblem-AlternateMethodofAcousticNoiseAnalysis 本帖最后由doumei于2010-4-2617:19编辑
11DesigningElectronicsforShockEnvironments
11.1 Introduction
11.2 SpecifyingtheShockEnvironment
11.3 PulseShock
11.4 Half-SineShockPulseforZeroReboundandFullRebound
11.5 SampleProblem-Half-SineShock-PulseDropTest
ResponseofElectronicStructurestoShockPulses
11.6 ResponseofaSimpleSystemtoVariousShockPulses
11.7 HowPCBsRespondtoShockPulses
11.8 DeterminingtheDesiredPCBResonantFrequencyforShock
SampleProblem-ResponseofaPCBtoaHalf-Sine
11.9 ResponseofPCBtoOtherShockPulses
SampleProblem-ShockResponseofaTransformerMountingBracket
11.10 EquivalentShockPulse
SampleProblem-ShippingCrateforanElectronicBox
11.11 LowValuesoftheFrequencyRatioR
SampleProblem-ShockAmplificationforLow
11.12 FrequencyRatioRShockIsolators
SampleProblem-HeatDevelopedinanIsolator
11.13 InformationRequiredforShockIsolators
SampleProblem-SelectingaSetofShockIsolators
11.14 RingingEffectsinSystemswithLightDamping
11.15 HowTwo-Degree-of-FreedomSystemsRespondtoShock
11.16 TheOctaveRuleforShock
11.17 VelocityShock
SampleProblem-DesigningaCabinetforVelocityShock
11.18 NonlinearVelocityShock
SampleProblem-CushioningMaterialforaSensitiveElectronicBox
11.19 ShockResponseSpectrum
11.20 HowChassisandPCBsRespondtoShock
SampleProblem-ShockResponseSpectrumAnalysisforChassisandPCB
11.21 HowPyrotechnicShockCanAffectElectronicComponents
SampleProblem-ResonantFrequencyofaHybridDieBondWire
12 DesignandAnalysisofElectronicBoxes
12.1 Introduction
12.2 DifferentTypesofMounts
12.3 PreliminaryDynamicAnalysis
12.4 BoltedCovers
12.5 CoupledModes
12.6 DynamicLoadsinaChassis
12.7 BendingStressesintheChassis
12.8 BucklingStressRatioforBending
12.9 TorsionalStressesintheChassis
12.1 BucklingStressRatioforShear
12.11 MarginofSafetyforBuckling
12.12 Center-of-GravityMount
12.13 SimplerMethodforObtainingDynamicForcesandStressesonaChassis 13 EffectsofManufacturingMethodsontheReliabilityofElectronics
13.1 Introduction
13.2 TypicalTolerancesinElectronicComponentsandLeadWires
SampleProblem-EffectsofPCBTolerancesonFrequencyandFatigueLife
13.3 ProblemsAssociatedwithTolerancesonPCBThickness
13.4 EffectsofPoorBondingMethodsonStructuralStiffness
13.5 SolderingSmallAxialLeadedComponentsonThrough-HolePCBs
13.6 AreasWherePoorManufacturingMethodsHaveBeenKnowntoCauseProblems
13.7 AvionicIntegrityProgramandAutomotiveIntegrityProgram(AVIP)
13.8 TheBasicPhilosophyforPerforminganAVIPAnalysis
13.9 DifferentPerspectivesofReliability
14. VibrationFixturesandVibrationTesting
14.1 VibrationSimulationEquipment
14.2 MountingtheVibrationMachine
14.3 VibrationTestFixtures
14.4 BasicFixtureDesignConsiderations
14.5 EffectiveSpringRatesforBolts
14.6 BoltPreloadTorque
SampleProblem-DeterminingDesiredBoltTorque
14.7 RockingModesandOverturningMoments
14.8 Oil-FilmSliderTables
14.9 VibrationFixtureCounterweights
14.1 ASummaryforGoodFixtureDesign
14.11 SuspensionSystems
14.12 MechanicalFuses
14.13 DistinguishingBendingModesfromRockingModes
14.14 Push-BarCouplings
14.15 SliderPlateLongitudinalResonance
14.16 AccelerationForceCapabilityofShaker
14.17 PositioningtheServo-ControlAccelerometer
14.18 MoreAccurateMethodforEstimatingtheTransmissibilityQinStructures
SampleProblem-TransmissibilityExpectedforaPlug-inPCBVibrationTestingCaseHistories
14.19 Cross-CouplingEffectsinVibrationTestFixtures
14.20 ProgressiveVibrationShearFailuresinBoltedStructures
14.21 VibrationPush-BarCouplerswithBoltsLoadedinShear
14.22 BoltingPCBCentersTogethertoImproveTheirVibrationFatigueLife
14.23 VibrationFailuresCausedbyCarelessManufacturingMethods
14.24 AllegedVibrationFailurethatwasReallyCausedbyDroppingaLargeChassis
14.25 MethodsforIncreasingtheVibrationandShockCapabilityonExistingSystems
15 EnvironmentalStressScreeningforElectronicEquipment(ESSEE)
15.1 Introduction
15.2 EnvironmentalStressScreeningPhilosophy
15.3 ScreeningEnvironments
15.4 ThingsanAcceptableScreenAreExpectedtoDo
15.5 ThingsanAcceptableScreenAreNotExpectedtoDo
15.6 ToScreenorNottoScreen,ThatistheProblem
15.7 PreparationsPriortotheStartofaScreeningProgram
15.8 CombinedThermalCycling,RandomVibration,andElectricalOperation
15.9 SeparateThermalCycling,RandomVibration,andElectricalOperation
15.10 ImportanceoftheScreeningEnvironmentSequence
15.11 HowDamageCanBeDevelopedinaThermalCyclingScreen
15.12 EstimatingtheAmountofFatigueLifeUsedUpinaSampleProblem-FatigueLifeUsedUpinVibrationandThermalCyclingScreen 怎么没有5、6，不管怎么说，先谢谢分享。 回复4#rzq200
5，6传不上去，新建一个帖子也贴不上去，明天再试传传~ 不急，每天上传附件有限大小的，明天楼主再编辑2楼的贴子。把余下的附件一并上传。
谢谢楼主的热心，。 回复5#doumei 《VIBRATIONANALYSISFORELECTRONICEQUIPMENT》
AgoodbookIhavebeenseekingforforalongtime.
Thankyou,LZ,foryoursharingselfishly。！！！:victory: 我下不了，LZ帮帮忙 终于下完了，差点漏了一个7.