电子设备振动分析《VIBRATION ANALYSIS FOR ELECTRONIC EQUIPMENT》

doumei

书籍目录1        Introduction
1.1        VibrationSources
1.2        Definitions
1.3        VibrationRepresentation
1.4        DegreesofFreedom
1.5        VibrationModes
1.6        VibrationNodes
1.7        CoupledModes
1.8        Fasteners
1.9        ElectronicEquipmentforAirplanesandMissiles
1.10        ElectronicEquipmentforShipsandSubmarines
1.11        ElectronicEquipmentforAutomobiles,Trucks,andTrains
1.12        ElectronicsforOilDrillingEquipment
1.13        ElectronicsforComputers,Communication,andEntertainment
       
2        VibrationsofSimpleElectronicSystems
2.1        SingleSpring-MassSystemWithoutDamping
        SampleProblem-NaturalFrequencyofaCantileverBeam
2.2        Single-Degree-of-FreedomTorsionalSystems
        SampleProblem-NaturalFrequencyofaTorsionSystem
2.3        SpringsinSeriesandParallel
        SampleProblem-ResonantFrequencyofaSpringSystem
2.4        RelationofFrequencyandAccelerationtoDisplacement
        SampleProblem-NaturalFrequencyandStressinaBeam
2.5        ForcedVibrationswithViscousDamping
2.6        TransmissibilityasaFunctionofFrequency
        SampleProblem-RelatingtheResonantFrequencytotheDynamicDisplacement
2.7        MultipleSpring-MassSystemsWithoutDamping
        SampleProblem-ResonantFrequencyofaSystem
       
3        ComponentLeadWireandSolderJointVibrationFatigueLife
3.1        Introduction
3.2        VibrationProblemswithComponentsMountedHighAbovethePCB
        SampleProblem-VibrationFatigueLifeintheWiresofaTO-5Transistor
3.3        VibrationFatigueLifeinSolderJointsofaTO-5Transistor
3.4        RecommendationstoFixtheWireVibrationProblem
3.5        DynamicForcesDevelopedinTransformerWiresDuringVibration
        SampleProblem-DynamicForcesandFatigueLifein
3.6        TransformerLeadWiresRelativeDisplacementsBetweenPCBandComponentProduceLeadWireStrain
        SampleProblem-EffectsofPCBDisplacementonHybridReliability
       
4        BeamStructuresforElectronicSubassemblies
4.1NaturalFrequencyofaUniformBeam       
        SampleProblem-NaturalFrequenciesofBeams
4.2NonuniformCrossSections       
        SampleProblem-NaturalFrequencyofaBoxwithNonuniformSections
4.3CompositeBeams       
       
5        ComponentLeadWiresasBents,Frames,andArcs
5.1        ElectronicComponentsMountedonCircuitBoards
5.2        BentwithaLateralLoad-HingedEnds
5.3        StrainEnergy-BentwithHingedEnds
5.4        StrainEnergy-BentwithFixedEnds
5.5        StrainEnergy-CircularArcwithHingedEnds
5.6        StrainEnergy-CircularArcwithFixedEnds
5.7        StrainEnergy-CircularArcsforLeadWireStrainRelief
        SampleProblem-AddinganOffsetinaWiretoIncreasetheFatigueLife
       
6        PrintedCircuitBoardsandFlatPlates
6.1        VariousTypesofPrintedCircuitBoards
6.2        ChangesinCircuitBoardEdgeConditions
6.3        EstimatingtheTransmissibilityofaPrintedCircuitBoard
6.4        NaturalFrequencyUsingaTrigonometricSeries
6.5        NaturalFrequencyUsingaPolynomialSeriesSampleProblem-ResonantFrequencyofaPCB
6.6        NaturalFrequencyEquationsDerivedUsingtheRayleighMethod
6.7        DynamicStressesintheCircuitBoardSampleProblem-VibrationStressesinaPCB
6.8        RibsonPrintedCircuitBoards
6.9        RibsFastenedtoCircuitBoardswithScrews
6.10        PrintedCircuitBoardsWithRibsinTwoDirections
6.11        ProperUseofRibstoStiffenPlatesandCircuitBoards
6.12        QuickWaytoEstimatetheRequiredRibSpacingforCircuitBoards
6.13        NaturalFrequenciesforDifferentPCBShapeswithDifferentSupports
        SampleProblem-NaturalFrequencyofaTriangularPCBwithThreePointSupports
       
7        OctaveRule,Snubbing,andDampingtoIncreasethePCBFatigueLife
7.1        DynamicCouplingBetweenthePCBsandTheirSupportStructures
7.2        EffectsofLooseEdgeGuidesonPlug-inTypePCBs
7.3        DescriptionofDynamicComputerStudyfortheOctaveRule
7.4        TheForwardOctaveRuleAlwaysWorks
7.5        TheReverseOctaveRuleMustHaveLightweightPCBs
        SampleProblem-VibrationProblemswithRelaysMountedonPCBs
7.6        ProposedCorrectiveActionforRelays
7.7        UsingSnubberstoReducePCBDisplacementsandStresses
        SampleProblem-AddingSnubberstoImprovePCBReliability
7.8        ControllingthePCBTransmissibilitywithDamping
7.9        PropertiesofMaterialDamping
7.10        ConstrainedLayerDampingwithViscoelasticMaterials
7.11        WhyStiffeningRibsonPCBsareOftenBetterthanDamping
7.12        ProblemswithPCBViscoelasticDampers
       
8        PreventingSinusoidalVibrationFailuresinElectronicEquipment
8.1        Introduction
8.2        EstimatingtheVibrationFatigueLife
        SampleProblem-QualificationTestforanElectronicSystem
8.3        ElectronicComponentLeadWireStrainRelief
8.4        DesigningPCBsforSinusoidalVibrationEnvironments
        SampleProblem-DeterminingDesiredPCBResonantFrequency
8.5        HowLocationandOrientationofComponentonPCBAffectLife
8.6        HowWedgeClampsAffectthePCBResonantFrequency
        SampleProblem-ResonantFrequencyofPCBwithSideWedgeClamps
8.7        EffectsofLoosePCBSideEdgeGuides
        SampleProblem-ResonantFrequencyofPCBwithLooseEdgeGuides
8.8        SineSweepThroughaResonance
        SampleProblem-FatigueCyclesAccumulatedDuringaSineSweep
       
9        DesigningElectronicsforRandomVibration
9.1        Introduction
9.2        BasicFailureModesinRandomVibration
9.3        CharacteristicsofRandomVibration
9.4        DifferencesBetweenSinusoidalandRandomVibrations
9.5        RandomVibrationInputCurves
        SampleProblem-DeterminingtheInputRMSAccelerationLevel
9.6        RandomVibrationUnits
9.7        ShapedRandomVibrationInputCurves
        SampleProblem-InputRMSAccelerationsforSlopedPSDCurves
9.8        RelationBetweenDecibelsandSlope
9.9        IntegrationMethodforObtainingtheAreaUnderaPSDCurve
9.10        FindingPointsonthePSDCurve
        SampleProblem-FindingPSDValues
9.11        UsingBasicLogarithmstoFindPointsonthePSDCurve
9.12        ProbabilityDistributionFunctions
9.13        GaussianorNormalDistributionCurve
9.14        CorrelatingRandomVibrationFailuresUsingtheThree-BandTechnique
9.15        RayleighDistributionFunction
9.16        ResponseofaSingle-Degree-of-FreedomSystemtoRandomVibration
        SampleProblem-EstimatingtheRandomVibrationFatigueLife
9.17        HowPCBsRespondtoRandomVibration
9.18        DesigningPCBsforRandomVibrationEnvironments
        SampleProblem-FindingtheDesiredPCBResonantFrequency
9.19        EffectsofRelativeMotiononComponentFatigueLife
        SampleProblem-ComponentFatigueLife
9.20        It’stheInputPSDthatCounts,NottheInputRMSAcceleration
9.21        ConnectorWearandSurfaceFrettingCorrosion
        SampleProblem-DeterminingApproximateConnectorFatigueLife
9.22        Multiple-Degree-of-FreedomSystems
9.23        OctaveRuleforRandomVibration
        SampleProblem-ResponseofChassisandPCBtoRandomVibration
        SampleProblem-DynamicAnalysisofanElectronicChassis
9.24        DeterminingtheNumberofPositiveZeroCrossings
        SampleProblem-DeterminingtheNumberofPositiveZeroCrossings
       
10        AcousticNoiseEffectsonElectronics
10.1        Introduction
        SampleProblem-DeterminingtheSoundPressureLevel
10.2        MicrophonicEffectsinElectronicEquipment
10.3        MethodsforGeneratingAcousticNoiseTests
10.4        One-ThirdOctaveBandwidth
10.5        DeterminingtheSoundPressureSpectralDensity
10.6        SoundPressureResponsetoAcousticNoiseExcitation
        SampleProblem-FatigueLifeofaSheet-MetalPanelExposedtoAcousticNoise
10.7        DeterminingtheSoundAccelerationSpectralDensity
        SampleProblem-AlternateMethodofAcousticNoiseAnalysis

doumei

11DesigningElectronicsforShockEnvironments
11.1        Introduction
11.2        SpecifyingtheShockEnvironment
11.3        PulseShock
11.4        Half-SineShockPulseforZeroReboundandFullRebound
11.5        SampleProblem-Half-SineShock-PulseDropTest
        ResponseofElectronicStructurestoShockPulses
11.6        ResponseofaSimpleSystemtoVariousShockPulses
11.7        HowPCBsRespondtoShockPulses
11.8        DeterminingtheDesiredPCBResonantFrequencyforShock
        SampleProblem-ResponseofaPCBtoaHalf-Sine
11.9        ResponseofPCBtoOtherShockPulses
        SampleProblem-ShockResponseofaTransformerMountingBracket
11.10        EquivalentShockPulse
        SampleProblem-ShippingCrateforanElectronicBox
11.11        LowValuesoftheFrequencyRatioR
        SampleProblem-ShockAmplificationforLow
11.12        FrequencyRatioRShockIsolators
        SampleProblem-HeatDevelopedinanIsolator
11.13        InformationRequiredforShockIsolators
        SampleProblem-SelectingaSetofShockIsolators
11.14        RingingEffectsinSystemswithLightDamping
11.15        HowTwo-Degree-of-FreedomSystemsRespondtoShock
11.16        TheOctaveRuleforShock
11.17        VelocityShock
        SampleProblem-DesigningaCabinetforVelocityShock
11.18        NonlinearVelocityShock
        SampleProblem-CushioningMaterialforaSensitiveElectronicBox
11.19        ShockResponseSpectrum
11.20        HowChassisandPCBsRespondtoShock
        SampleProblem-ShockResponseSpectrumAnalysisforChassisandPCB
11.21        HowPyrotechnicShockCanAffectElectronicComponents
        SampleProblem-ResonantFrequencyofaHybridDieBondWire
12        DesignandAnalysisofElectronicBoxes
12.1        Introduction
12.2        DifferentTypesofMounts
12.3        PreliminaryDynamicAnalysis
12.4        BoltedCovers
12.5        CoupledModes
12.6        DynamicLoadsinaChassis
12.7        BendingStressesintheChassis
12.8        BucklingStressRatioforBending
12.9        TorsionalStressesintheChassis
12.1        BucklingStressRatioforShear
12.11        MarginofSafetyforBuckling
12.12        Center-of-GravityMount
12.13        SimplerMethodforObtainingDynamicForcesandStressesonaChassis

doumei

13        EffectsofManufacturingMethodsontheReliabilityofElectronics
13.1        Introduction
13.2        TypicalTolerancesinElectronicComponentsandLeadWires
        SampleProblem-EffectsofPCBTolerancesonFrequencyandFatigueLife
13.3        ProblemsAssociatedwithTolerancesonPCBThickness
13.4        EffectsofPoorBondingMethodsonStructuralStiffness
13.5        SolderingSmallAxialLeadedComponentsonThrough-HolePCBs
13.6        AreasWherePoorManufacturingMethodsHaveBeenKnowntoCauseProblems
13.7        AvionicIntegrityProgramandAutomotiveIntegrityProgram(AVIP)
13.8        TheBasicPhilosophyforPerforminganAVIPAnalysis
13.9        DifferentPerspectivesofReliability
       
14.        VibrationFixturesandVibrationTesting
14.1        VibrationSimulationEquipment
14.2        MountingtheVibrationMachine
14.3        VibrationTestFixtures
14.4        BasicFixtureDesignConsiderations
14.5        EffectiveSpringRatesforBolts
14.6        BoltPreloadTorque
        SampleProblem-DeterminingDesiredBoltTorque
14.7        RockingModesandOverturningMoments
14.8        Oil-FilmSliderTables
14.9        VibrationFixtureCounterweights
14.1        ASummaryforGoodFixtureDesign
14.11        SuspensionSystems
14.12        MechanicalFuses
14.13        DistinguishingBendingModesfromRockingModes
14.14        Push-BarCouplings
14.15        SliderPlateLongitudinalResonance
14.16        AccelerationForceCapabilityofShaker
14.17        PositioningtheServo-ControlAccelerometer
14.18        MoreAccurateMethodforEstimatingtheTransmissibilityQinStructures
        SampleProblem-TransmissibilityExpectedforaPlug-inPCBVibrationTestingCaseHistories
14.19        Cross-CouplingEffectsinVibrationTestFixtures
14.20        ProgressiveVibrationShearFailuresinBoltedStructures
14.21        VibrationPush-BarCouplerswithBoltsLoadedinShear
14.22        BoltingPCBCentersTogethertoImproveTheirVibrationFatigueLife
14.23        VibrationFailuresCausedbyCarelessManufacturingMethods
14.24        AllegedVibrationFailurethatwasReallyCausedbyDroppingaLargeChassis
14.25        MethodsforIncreasingtheVibrationandShockCapabilityonExistingSystems
       
       
15        EnvironmentalStressScreeningforElectronicEquipment(ESSEE)
15.1        Introduction
15.2        EnvironmentalStressScreeningPhilosophy
15.3        ScreeningEnvironments
15.4        ThingsanAcceptableScreenAreExpectedtoDo
15.5        ThingsanAcceptableScreenAreNotExpectedtoDo
15.6        ToScreenorNottoScreen,ThatistheProblem
15.7        PreparationsPriortotheStartofaScreeningProgram
15.8        CombinedThermalCycling,RandomVibration,andElectricalOperation
15.9        SeparateThermalCycling,RandomVibration,andElectricalOperation
15.10        ImportanceoftheScreeningEnvironmentSequence
15.11        HowDamageCanBeDevelopedinaThermalCyclingScreen
15.12        EstimatingtheAmountofFatigueLifeUsedUpinaSampleProblem-FatigueLifeUsedUpinVibrationandThermalCyclingScreen

rzq200

怎么没有5、6，不管怎么说，先谢谢分享。

doumei

回复4#rzq200
5，6传不上去，新建一个帖子也贴不上去，明天再试传传~

admin

不急，每天上传附件有限大小的，明天楼主再编辑2楼的贴子。把余下的附件一并上传。

谢谢楼主的热心，。

doumei

回复5#doumei

Allen_jje

《VIBRATIONANALYSISFORELECTRONICEQUIPMENT》
AgoodbookIhavebeenseekingforforalongtime.
Thankyou,LZ,foryoursharingselfishly。！！！

zhs

我下不了，LZ帮帮忙

fanxue3

终于下完了，差点漏了一个7.