WernerEngelmaier,knownintheindustryas'Mr.Reliability,'wasresponsibleforelectronichardwarereliabilityatAT&TBellTelephoneLaboratoriesfor24yearsasa'DistinguishedMemberofTechnicalStaff'beforestartinghisconsultingpracticein1990onreliabilityissuesinelectronicpackagingandinterconnectiontechnology.Inparticular,hedevelopedwidelyusedreliabilitypredictionmodelsforSMTsolderjoints,printedcircuitboardthrough-holesandvias,andflexibleprintedcircuitry.
Hehasover210technicalpublicationsandcontributions.Hasgivenseminarson5continents.
Along-timememberofIPC,heisthechairmanoftheProductReliabilityCommittee;underhisleadershipand/orwithconsiderablecontributions,industrydocumentsIPC-SM-785“GuidelinesforAcceleratedReliabilityTestingofSurfaceMountSolderAttachments,”IPC-D-279“DesignGuidelinesforReliableSurfaceMountTechnologyPrintedBoardAssemblies,”IPC-TR-484,“ResultsofIPCCopperFoilDuctilityRoundRobinStudy,”IPC-TR-579“RoundRobinReliabilityEvaluationofSmallDiameterPlatedThroughHolesinPrintedWiringBoards,”IPC-9701“PerformanceTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachments,"IPC-9702"MonotonicBendCharacterizationofBoard-LevelInterconnects"andmanyothersweredeveloped.
WerneristherecipientofAustria'sTGM-Exner-Medal,IEPS’sElectronicPackagingAchievementAwardandIPCPresident'sAwardforhiscontributionstotheadvancementofElectronicInterconnectionTechnologyandtheElectronicsIndustry.HeisaFellowofIMAPSandhasbeeninductedintotheIPCHallofFame.HeisaregularcolumnistfortheGlobalSMT&Packagingmagazine.
WernerEngelmaierholdsMechanicalEngineeringdegreesfromTGM,Vienna,Austria;USC,SC;andMIT.
Specialties
Electronichardwarereliabilityassessment;Design-for-Reliability(DfR);solderjointreliability;PCBreliability;acceleratedreliabilitytesting;failureandrootcauseanalysis;in-housetraining;expertconsultantinelectronichardwarefailuresandpatentlitigations. |