哪位达人可以提供J-STD-030？谢谢！

ice_fang

哪位达人可以提供J-STD-030？谢谢！

sunjj

J-STD-030GuidelineforSelectionandApplicationofUnderfillMaterialforFlipChipandotherMicropackages

只有一份2000年的草案，仅供参考。

yeh

谢谢！sunjj

yeh

下载2次都没成功,请老大确认一下那里出问题了

admin

yeh发表于2013-1-1521:29
下载2次都没成功,请老大确认一下那里出问题了

你的速度有点慢哦。可以正常下载啊。下面是附件部分内容摘录，你再试着下一下。若再不行，明天我发你邮箱里.

J-STD-030
December2000
GuidelineforSelectionandApplicationofUnderfillMaterial
forFlipChipandotherMicropackagesDraft7
UnderfillAdhesivesfor
FlipChipApplicationsTaskGroup(5-24f)

1Scope
Thisguidelinecoverspolymerbasedunderfillmaterialsintendedforuseinelectronicpackagingassembly
applicationstorelievestressonjointsthatinterconnectflipchips(FC),chipscalepackages(CSP)andballgrid
arrays(BGA)toaninterconnectingsubstrate.
1.1Purpose
Thepurposeofthisdocumentistoestablishevaluationcriterionformaterial,thatwhenusedincombinationwiththe
assemblyandjoiningprocesses,willsubstantiallyincreasethethermalfatiguelifeofI/Oconnections(e.g.,solder
bumps,goldbumps,conductiveadhesive,combinations)particularlywhenthereiscoefficientofthermalexpansion
(CTE)mismatch,substantiallydifferentexpansionvaluesbetweentheflipchiporotherpackageandtheassembly
substrate.
1.2Intent
Theintentofthedocumentistohelpinidentifyingunderfillmaterialswhosepropertiesarecompatiblewith
componentassemblyjointstoreducethermomechanicalstresssothatperformanceoftheassemblyisenhanced.The
additionalroleofunderfillisprotectingthedevicefromenvironmentalfactorsandincreasingstrength.Materials
usedinunderfillapplicationsshouldnotadverselyaffectdevicereliability(ionicimpurities,alphaemitters)nor
degradeelectricalperformance.Evaluationmethodsareprovidedinthedocumentthatareintendedtobeusedfor
assessingunderfillmaterialperformanceinspecificapplications.Methodsarealsoincludedthatwillassistin
estimatingprocessingtime.
2Applicabledocuments
2.1IPC
IPC-T-50TermsandDefinitionsforInterconnectingandPackagingElectronicCircuits
IPC-SM-782SurfaceMountDesignandLandPatternStandard
IPC-SM785GuidelinesforAcceleratedReliabilityTestingofSurfaceMountSolderAttachments
IPC-SM-840QualificationandPerformanceofPermanentSolderMask
IPC-TM-650TestMethodsManual
TM2.4.28Adhesion,SolderMask(Non-MeltingMetals)
TM2.6.1FungusResistancePrintedWiringMaterials
TM2.6.3.3SurfaceInsulationResistance,Fluxes
TM2.6.14.1ElectrochemicalMigrationResistanceTest
2.2JointIndustryStandard
J-STD-004RequirementsforSolderingFluxes
J-STD-012ImplementationOfFlipChipandChipScaleTechnology
J-STD-020Moisture/ReflowSensitivityClassificationforNon-HermeticSolidStateSurfaceMountDevices
J-STD-026SemiconductorDesignStandardforFlipChipApplications
J-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps
2.3AmericanSocietyforTestingandMaterials(ASTM)
ASTM-D-150StandardTestMethodsforACLossCharacteristicsandPermittivity(DielectricConstant)ofSolid
ElectricalInsulation
ASTMD257StandardTestMethodsforDCResistanceorConductanceofInsulatingMaterials

yeh

admin发表于2013-1-1523:27
你的速度有点慢哦。可以正常下载啊。下面是附件部分内容摘录，你再试着下一下。若再不行，明天我发你邮箱...

正常下载,谢谢！