ASME 2009 InterPACK Conference, pp. 159-170

yeh

求助文件:Lall,P.,Shirgaokar,A.,Arunachalam,D.AndSuhling,J.,“PCRforDerivationofParameterDependencies,Thermo-MechanicalNorris-LandzbergAccelerationFactors,GoldmannFatigueConstantsforLead-freeElectronics.”ProceedingsfromASME2009InterPACKConference,pp.159-170.

yeh

ASME2009InterPACKConference,pp.159-170



ABSTRACT
GoldmannConstantsandNorris-Landzbergaccelerationfactorsforlead-freesoldershavebeendevelopedbasedon
principalcomponentregressionmodels(PCR)forreliabilitypredictionandpartselectionofarea-arraypackaging
architecturesunderthermo-mechanicalloads.ModelshavebeendevelopedinconjunctionwithStepwiseRegression
Methodsforidentificationofthemaineffects.Packagearchitecturesstudiedinclude,BGApackagesmountedon
copper-coreandno-coreprintedcircuitassembliesinharshenvironments.Themodelshavebeendevelopedbasedon
thermo-mechanicalreliabilitydataacquiredoncopper-coreandno-coreassembliesinfourdifferentthermalcyclingconditions.
PackageswithSn3Ag0.5Cusolderalloyinterconnectshavebeenexamined.Themodelshavebeendevelopedbasedon
perturbationofacceleratedtestthermo-mechanicalfailuredata.

DatahasbeengatheredonninedifferentthermalcycleconditionswithSAC305alloys.Thethermalcycleconditions
differintemperaturerange,dwelltimes,maximumtemperatureandminimumtemperaturetoenabledevelopmentofconstants
neededforthelifepredictionandassessmentofaccelerationfactors.GoldmannConstantsandtheNorris-Landzberg
accelerationfactorshavebeenbenchmarkedagainstpreviouslypublishedvalues.Inaddition,modelpredictionshavebeen
validatedagainstvalidationdata-setswhichhavenotbeenusedformodeldevelopment.

victor-he

yeh神人也。。这也能有Substitutingm=1.9,β=0.58intotheequation,