sony quality and reliability manual

abo

希望对大家有所帮助

cliffcrag

楼主没有上传完资料？？

sunjj

是这个吗?
<SONYSEMICONDUCTQualityandReliabilityHandbook>

cliffcrag

SUNJJ的资料，下载下来要加上RAR的后缀名哦，摘录一下目录出来！

CHAPTER1-QUALITYASSURANCEFORSEMICONDUCTORDEVICES
1.1ApproachtowardQualityAssurance..........................................................10
1.2QualityAssuranceSystemforSemiconductorDevices............................16
1.3ProductShippingQualityAssurance..........................................................26
1.4ProductLiability(PL)Act..............................................................................29
CHAPTER2-FAILUREMECHANISMS
2.1FailureModesandMechanisms.................................................................34
2.2FailureMechanismsRootedinDesignandtheWaferProcess................34
2.3FailureMechanismsRootedintheAssemblyProcess..............................52
2.4FailureMechanismsRootedintheMountingProcessandOccurringintheField.....59
CHAPTER3-FAILUREANALYSIS
3.1WhatisFailureAnalysis?.............................................................................98
3.2NecessityofFailureAnalysis.......................................................................99
3.3FailureAnalysis.............................................................................................99
CHAPTER4-RELIABILITYTESTSANDRELIABILITYPREDICTION
4.1ApproachTowardReliability......................................................................120
4.2WhatareReliabilityTests...........................................................................121
4.3AcceleratedLifeTests................................................................................127
4.4ReliabilityEvaluationbyTEG....................................................................130
4.5ReliabilityPrediction...................................................................................136
4.6TestCoverage.............................................................................................151
4.7ReliabilityRelatedStandards.....................................................................152
4
Contents
CHAPTER5-NOTESONTHEUSEOFSEMICONDUCTORDEVICES
5.1EvaluationandAssuranceofSolderingHeatResistance.....................164
5.2NotesonHandlingforElectricBreakdown............................................179
5.3NotesonHandlingforMechanicalBreakdown.....................................191
5.4NotesonHandlingtoPreventThermalBreakdown..............................197
5.5NotesonHandlingtoPreventMisoperation..........................................203
5.6NotesonProductSpecifications,Packing,TransportandStorage......205
Appendix
1LotandProductNameIndications..........................................................218
2SamplingInspections...............................................................................223
3SaturatedVaporPressureTable..............................................................228
4BasicReliabilityTheory............................................................................232
5

fiona

很好的资料可惜我只下载了一个，就没钱了

fiona

楼主是否可以传给我一份jean_hai222@126.com

fiona

下载后不知为何不能解压，费了好大的劲，下了几次了，几次花光钱

cingchang

我怎麼又沒錢

我真是太窮啦

zmz712

没钱，不能下载哦

zmz712

好东西，学习以下