各位大俠foryourreference.
GenericReliabilityAssuranceRequirementsforOptoelectronic
DevicesUsedinTelecommunicationsEquipmentAModuleofRQGR,FR-796
TelcordiaTechnologiesGenericRequirementsGR-468-CORE
Issue2,September2004
1Introduction
1.1ScopeandPurpose.................................1–1
1.2ReliabilityAssurance-OverviewandPhilosophy................1–2
1.2.1OverviewofReliabilityAssurance......................1–2
1.2.2ReliabilityAssuranceGenericRequirementsPhilosophy.........1–3
1.3DocumentHistory..................................1–4
1.3.1ChangesBetweenIssues1and2ofGR-468-CORE.............1–4
1.3.2ChangesBetweenTR-NWT-000468/TA-NWT-000983andGR-468-CORE,
Issue1....................................1–5
1.4RelatedTelcordiaDocuments...........................1–6
1.5Terminology.....................................1–7
1.5.1DeviceTerminology..............................1–7
1.5.2Suppliers,Manufacturers,andCustomers.................1–11
1.5.3OperatingEnvironments...........................1–11
1.5.3.1COEnvironment............................1–12
1.5.3.2UNCEnvironment...........................1–12
1.5.4QualityLevels.................................1–13
1.5.5FailureRates..................................1–15
1.5.6RequirementsTerminology..........................1–15
1.6RequirementLabelingConventions........................1–16
1.6.1NumberingofObjects.............................1–16
1.6.2IdentificationofObjectContent.......................1–16
1.6.3RequirementObjectAbsoluteNumberAssignment............1–17
2ReliabilityAssuranceProcesses
2.1SupplierApprovalandDeviceQualification...................2–1
2.1.1SpecificationandControl...........................2–2
2.1.2SupplierApproval...............................2–2
2.1.3CommonProcess-RelatedCriteriaforDeviceQualification.......2–3
2.1.3.1QualificationTestDocumentation..................2–3
2.1.3.2QualificationofDevicesbySimilarity.................2–5
2.1.3.3LevelsofAssemblyforQualification.................2–5
2.1.3.4ProvisionalUseofDevices.......................2–6
2.1.3.5UseofSupplier-ProvidedData.....................2–8
2.1.3.6TreatmentofInternallyManufacturedDevices...........2–8
2.1.3.7SamplingforQualificationTests...................2–9
2.1.3.7.1LTPDSamplingPlan.......................2–9
2.1.3.7.2UseofNonconformingDevicesforQualification.......2–10
2.1.3.7.3TreatmentofLowVolumeParts................2–11
2.1.3.7.4CharacterizationTestDataforAdditionalSamples......2–11
2.1.3.7.5AdditionalConsiderationsforStressTests..........2–11
2.1.3.8DeviceCodesthatFailQualification.................2–12
2.1.4Requalification.................................2–13
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