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Accelerated Thermal Cycling

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发表于 2008-4-16 13:51:42 | 显示全部楼层 |阅读模式
AcceleratedThermalCyclingandFailureMechanismsforBGAandCSPAssemblies
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Introduction
Reliability,irrespectiveofitsdefinition,isnolongeran‘‘afterthe-fact’’concept;rather,itmustbeanintegralpartofdevelopmentandimplementation.Thisisspecificallytrueformicroelectronics
withdemandsforminiaturizationandsystemintegrationinafaster,better,andcheaperenvironment.BGAsandCSPsrapiddevelopmentandintroductionintothemarketisagoodexampleofthistrend.
Theuseofnewmaterials,processes,andnewapplicationsobscurethetraditionaldefinitionofqualityandreliabilityassurance.

Newsystemsapproachesareneededtoassurequalityandreliabilityaswellastomanagerisks.Qualityshouldbeassuredbydesignforreliability,controlsforprocesses,tailoredtestingmethods
forqualification,anduseofuniqueacceleratedenvironmentaltestingalongwithcredibleanalyticalprediction.Inotherwords,anefficientconcurrentengineeringsystemapproachmustbeimplemented.
EnvironmentalTesting.Amongthemanyenvironmentalacceleratedtestingmethodologiesforassessingreliabilityofelectronicsystems,thermalcyclingisthemostcommonlyusedforthe
characterizationofdevicesaswellasinterconnections.Fromthemanypredefinedthermalcyclingprofiles,themilitaryandcommercialrangesrepresentthetwoextremes.Previously,NASA
alsohadapresetspecificthermalcyclingrequirement.AlthoughanumberofMilitaryStandardswereobsoleted,theyarestillusedforbenchmarktesting.Forexample,withinMil-STD-883,there
arethreelevelsofacceleratedcyclingtemperatures

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发表于 2008-4-28 21:28:54 | 显示全部楼层
谢谢很好,有关热循环的资料!
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发表于 2008-4-29 20:07:21 | 显示全部楼层
Thankyouverymuch!!!
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发表于 2010-4-26 16:02:46 | 显示全部楼层
很有作用哦,支持下
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发表于 2010-4-26 21:33:00 | 显示全部楼层
感谢lz分享
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发表于 2010-9-23 21:24:21 | 显示全部楼层
非常好,谢谢
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