SMIA 可靠度規範

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SMIA1.0Part6:ReliabilitySpecification

1.Overview.......8
1.1Objective.......8
1.2ScopeofApplication.....8
2.GeneralRequirements..8
2.1PerformanceMeasurements.8
2.2StandardMeasurementEnvironment...8
2.3MeasurementSystemAnalysis.....8
2.4TestDataAvailability....9
2.5RequalificationRequirements.......9
3.TestClassification......10
3.1LotAcceptanceTests(GroupA).10
3.2ReliabilityMonitoringTests(GroupB)10
3.3Research&DevelopmentLevelTests(GroupC).......10
3.4MechanicalTestsforConnectionSystems(GroupD)10
3.5TestsforChanges.......11
4.TestRequirements......11
4.1GroupATests(LotAcceptanceTestsforcameramodule)11
4.1.1A1,ElectricalCharacteristics.......11
4.1.2A2,MechanicalCharacteristics...11
4.1.3A3,OpticalCharacteristics..11
4.1.4A4,ShippingPackagesandLabels.....11
4.2GroupBTests(ReliabilityMonitoringTestsforcameramodule).......11
4.2.1B1,HighTemperatureOperatingLifeTest/EarlyLifeFailureRateEstimation.11
4.2.2B2,Temperature&HumidityStressTest....12
4.2.3B2.3MechanicalImpactTests....14
4.3GroupCTests(R&DTestsforcameramodule).15
4.3.1C1:DoB1TestAgain..15
4.3.2C2:CombinationTest;TestB2+(B2.2andB2.3)......15
4.3.3C3:HighTemperature.15
4.3.4C4;RandomVibration.15
4.3.5C5:LatchUpTest16
4.3.6C6SteadyStateTemperatureHumidityBiasLifeTest.......16
4.3.7C7HighTemperatureOperatingLifeTest..17
4.3.8C8LowTemperatureOperatingLifeTest...17
4.3.9C9SolarRadiationTest......17
4.4GroupDTests:MechanicalTestsforConnectionSystems(Connectors&FPC)......18
4.4.1D1VibrationTests.......18
4.4.2D2Pull-OutTest(CameraModulefromtheSocketIncaseApplicable)....19
4.4.3D3Peel-OutTestoftheFPC(inCaseApplicable).....19
4.4.4D4ModuleInsertionTest....19
4.4.5D5FlexBendingTest..19
4.4.6D6ConnectorQualityCheck.......19
4.4.7D7MechanicalImpactTests.......20
5.References...21
5.1IECStandards....21
5.2JEDECStandards......21