谢谢钟兄的分享,如下是内容摘要:
FAILUREMECHANISMBASEDSTRESSTESTQUALIFICATIONFORINTEGRATEDCIRCUITS
AutomotiveElectronicsCouncil
TABLEOFCONTENTS
AEC-Q100FailureMechanismBasedStressTestQualificationforIntegratedCircuits
Appendix1:DefinitionofaQualificationFamily
Appendix2:Q100CertificationofDesign,ConstructionandQualification
Appendix3:PlasticPackageOpeningforWireBondTesting
Appendix4:MinimumRequirementsforQualificationPlansandResults
Appendix5:PartDesignCriteriatoDetermineNeedforEMCTesting
Appendix6:PartDesignCriteriatoDetermineNeedforSERTesting
Attachments
AEC-Q100-001:WIREBONDSHEARTEST
AEC-Q100-002:HUMANBODYMODEL(HBM)ELECTROSTATICDISCHARGE(ESD)TEST
AEC-Q100-003:MACHINEMODEL(MM)ELECTROSTATICDISCHARGE(ESD)TEST
AEC-Q100-004:ICLATCH-UPTEST
AEC-Q100-005:NONVOLATILEMEMORYWRITE/ERASEENDURANCE,DATARETENTION,
ANDOPERATIONALLIFETEST
AEC-Q100-006:ELECTRO-THERMALLYINDUCEDPARASITICGATELEAKAGE(GL)TEST
AEC-Q100-007:FAULTSIMULATIONANDTESTGRADING
AEC-Q100-008:EARLYLIFEFAILURERATE(ELFR)
AEC-Q100-009:ELECTRICALDISTRIBUTIONASSESSMENT
AEC-Q100-010:SOLDERBALLSHEARTEST
AEC-Q100-011:CHARGEDDEVICEMODEL(CDM)ELECTROSTATICDISCHARGE(ESD)
TEST
AEC-Q100-012:SHORTCIRCUITRELIABILITYCHARACTERIZATIONOFSMARTPOWER
DEVICESFOR12VSYSTEMS |